Invention Grant
- Patent Title: Imaging element mounting board, producing method of imaging element mounting board, and mounting board assembly
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Application No.: US16499987Application Date: 2018-04-04
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Publication No.: US11081437B2Publication Date: 2021-08-03
- Inventor: Shusaku Shibata , Yoshihiro Kawamura , Hayato Takakura , Takahiro Takano , Shuichi Wakaki
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils LLC
- Agent Jean C. Edwards, Esq.
- Priority: JPJP2017-077542 20170410,JPJP2017-201977 20171018,JPJP2018-071825 20180403
- International Application: PCT/JP2018/014380 WO 20180404
- International Announcement: WO2018/190215 WO 20181018
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/552 ; H05K1/09 ; H04N5/225 ; H01L21/48
Abstract:
An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.
Information query
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