公开(公告)号：US12137522B2

公开(公告)日：2024-11-05

申请号：US17783537

申请日：2020-12-15

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito Fukushima ,  Shusaku Shibata ,  Teppei Niino

IPC: H05K1/05 ,  H05K1/09 ,  H05K1/18 ,  H05K3/32

Abstract: A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.

公开(公告)号：US11337302B2

公开(公告)日：2022-05-17

申请号：US16755733

申请日：2018-10-12

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Takahiro Takano ,  Hiromoto Haruta ,  Shuichi Wakaki

IPC: H05K1/02

Abstract: A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 μm or less.

公开(公告)号：US11081437B2

公开(公告)日：2021-08-03

申请号：US16499987

申请日：2018-04-04

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Yoshihiro Kawamura ,  Hayato Takakura ,  Takahiro Takano ,  Shuichi Wakaki

IPC: H01L23/498 ,  H01L23/552 ,  H05K1/09 ,  H04N5/225 ,  H01L21/48

Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.

公开(公告)号：US11032913B2

公开(公告)日：2021-06-08

申请号：US16464422

申请日：2017-11-06

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Takahiro Takano ,  Hayato Takakura ,  Yoshihiro Kawamura ,  Shuichi Wakaki

IPC: H05K1/02 ,  H05K3/10 ,  H05K1/18 ,  H05K3/18

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0

公开(公告)号：US10537909B2

公开(公告)日：2020-01-21

申请号：US15326108

申请日：2015-06-03

Applicant: NITTO DENKO CORPORATION

Inventor： Daniel Popovici ,  Keita Mine ,  Shusaku Shibata ,  Toshitaka Nakamura

IPC: B05B13/02 ,  B05B14/00 ,  B05D7/04 ,  B05D1/12 ,  C23C24/04 ,  C23C4/14 ,  C23C4/137 ,  B05B7/14 ,  B05B7/24 ,  B05D7/14

Abstract: A powder coating apparatus for attaching powder to a film includes a forwarding roll which forwards the film; a take-up roll which is arranged on the downstream side of a conveyance direction of the film with respect to the forwarding roll and which takes up the film; a film-forming nozzle which is arranged between the forwarding roll and the take-up roll in the conveyance direction so as to be opposed to the film and which jets the powder; a first casing or a second casing which accommodates the forwarding roll and the take-up roll; an apparatus casing which accommodates the film-forming nozzle, the first casing, and the second casing; and a pressure adjustment unit configured to set an internal pressure of the first casing and the second casing to be higher than an internal pressure of the apparatus casing.

公开(公告)号：US10203430B2

公开(公告)日：2019-02-12

申请号：US15664747

申请日：2017-07-31

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Katsunori Takada ,  Hiroyuki Takemoto

IPC: G02B1/04 ,  G02B1/14 ,  G02B5/30 ,  G02B1/10

Abstract: There is provided an optical laminate excellent in adhesiveness between a (meth)acrylic resin film (base material film) having low moisture permeability and a UV absorbing ability and a hard coat layer, and has suppressed interference unevenness. An optical laminate according to an embodiment of the present invention includes: a base material layer formed of a (meth)acrylic resin film; a hard coat layer formed by applying a composition for forming a hard coat layer to the (meth)acrylic resin film; and a penetration layer formed through penetration of the composition for forming a hard coat layer into the (meth)acrylic resin film, the penetration layer being placed between the base material layer and the hard coat layer, wherein the penetration layer has a thickness of 1.2 μm or more.

公开(公告)号：US11627661B2

公开(公告)日：2023-04-11

申请号：US17338130

申请日：2021-06-03

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Hayato Takakura ,  Masaki Ito ,  Yoshihiro Kawamura ,  Shuichi Wakaki

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.

公开(公告)号：US11266024B2

公开(公告)日：2022-03-01

申请号：US17237616

申请日：2021-04-22

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku Shibata ,  Takahiro Takano ,  Hayato Takakura ,  Yoshihiro Kawamura ,  Shuichi Wakaki

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/10 ,  H05K1/18 ,  H05K3/18

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0

公开(公告)号：US11183448B2

公开(公告)日：2021-11-23

申请号：US16607612

申请日：2018-04-23

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato Takakura ,  Shuichi Wakaki ,  Shusaku Shibata ,  Yoshihiro Kawamura ,  Masaki Ito

IPC: H01L23/498 ,  H01L27/146 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H04N5/225

Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.

公开(公告)号：US11122676B2

公开(公告)日：2021-09-14

申请号：US16607580

申请日：2018-04-25

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato Takakura ,  Yoshihiro Kawamura ,  Shuichi Wakaki ,  Shusaku Shibata

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18

Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.