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公开(公告)号：US11647269B2
公开(公告)日：2023-05-09
申请号：US16756253
申请日：2018-10-02
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku Shibata , Hayato Takakura , Yoshihiro Kawamura , Masaki Ito , Shuichi Wakaki
IPC: H04N5/225 , H01L27/146 , H04N5/369
CPC classification number: H04N5/2253 , H01L27/14636 , H04N5/369
Abstract: An imaging element-mounting board includes a board area having a board disposed and a plurality of reinforcement portions disposed around the board area. The plurality of reinforcement portions are independent from each other.
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公开(公告)号：US11058002B2
公开(公告)日：2021-07-06
申请号：US16649825
申请日：2018-09-06
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku Shibata , Hayato Takakura , Masaki Ito , Yoshihiro Kawamura , Shuichi Wakaki
Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.
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公开(公告)号：US11229116B2
公开(公告)日：2022-01-18
申请号：US16755736
申请日：2018-10-02
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku Shibata , Hiromoto Haruta , Shuichi Wakaki
Abstract: A board assembly sheet includes a plurality of mounting boards each for mounting an electronic component. The mounting boards are defined in the board assembly sheet. The mounting board has a total thickness of 60 μm or less. The board assembly sheet has a through hole passing through the board assembly sheet in a thickness direction. The through hole is formed to be along an end edge of the mounting board or along a phantom line extending along the end edge.
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公开(公告)号：US10813221B2
公开(公告)日：2020-10-20
申请号：US16607616
申请日：2018-04-25
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku Shibata , Hayato Takakura , Yoshihiro Kawamura , Shuichi Wakaki
Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 μm or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10−6/% RH or less.
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公开(公告)号：US11337302B2
公开(公告)日：2022-05-17
申请号：US16755733
申请日：2018-10-12
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku Shibata , Takahiro Takano , Hiromoto Haruta , Shuichi Wakaki
IPC: H05K1/02
Abstract: A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 μm or less.
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Patent Agency Ranking
公开(公告)号：US11081437B2
公开(公告)日：2021-08-03
申请号：US16499987
申请日：2018-04-04
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku Shibata , Yoshihiro Kawamura , Hayato Takakura , Takahiro Takano , Shuichi Wakaki
IPC: H01L23/498 , H01L23/552 , H05K1/09 , H04N5/225 , H01L21/48
Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.
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公开(公告)号：US11032913B2
公开(公告)日：2021-06-08
申请号：US16464422
申请日：2017-11-06
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku Shibata , Takahiro Takano , Hayato Takakura , Yoshihiro Kawamura , Shuichi Wakaki
Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0
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公开(公告)号：US12273997B2
公开(公告)日：2025-04-08
申请号：US17296805
申请日：2019-10-28
Applicant: NITTO DENKO CORPORATION
Inventor： Rihito Fukushima , Hayato Takakura , Shuichi Wakaki
Abstract: A wiring circuit board includes a base insulating layer, a conductive layer, and a metal protective film in order toward one side in a thickness direction. The conductive layer includes a signal wiring and a terminal continuous therewith. The signal wiring has one surface in the thickness direction, and first and second surfaces continuous with the one surface and disposed to face each other in a width direction. The terminal has one surface in the thickness direction, and the other surface disposed to face the one surface at the other side in the thickness direction at spaced intervals thereto. The other surface of the terminal is exposed from the base insulating layer toward the other side in the thickness direction. The metal protective film covers the one surface of the signal wiring and one surface of the terminal but not both first or second surfaces.
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公开(公告)号：US11627661B2
公开(公告)日：2023-04-11
申请号：US17338130
申请日：2021-06-03
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku Shibata , Hayato Takakura , Masaki Ito , Yoshihiro Kawamura , Shuichi Wakaki
Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.
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公开(公告)号：US11266024B2
公开(公告)日：2022-03-01
申请号：US17237616
申请日：2021-04-22
Applicant: NITTO DENKO CORPORATION
Inventor： Shusaku Shibata , Takahiro Takano , Hayato Takakura , Yoshihiro Kawamura , Shuichi Wakaki
Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0
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