Invention Grant
- Patent Title: Junction structure
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Application No.: US16794445Application Date: 2020-02-19
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Publication No.: US11088308B2Publication Date: 2021-08-10
- Inventor: Takasi Satou , Susumu Taniguchi , Hideyuki Kobayashi , Makoto Orikasa
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L23/00
Abstract:
A bonding structure is a bonding structure which bonds a light emitting element and a substrate and includes a first electrode formed on the light emitting element, a second electrode formed on the substrate, and a bonding layer which bonds the first electrode and the second electrode, and the bonding layer contains a first bonding metal component and a second bonding metal component different from the first bonding metal component.
Public/Granted literature
- US20200321499A1 JUNCTION STRUCTURE Public/Granted day:2020-10-08
Information query
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