公开(公告)号：US11410855B2

公开(公告)日：2022-08-09

申请号：US16997092

申请日：2020-08-19

申请人： TDK CORPORATION

发明人： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC分类号： H01L21/48 ,  G03F7/00 ,  H01L33/62 ,  C23C18/18 ,  C23C18/20 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  H01L23/00 ,  C23C18/38 ,  H01L25/075

摘要： A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US09620156B2

公开(公告)日：2017-04-11

申请号：US15071989

申请日：2016-03-16

申请人： TDK CORPORATION

发明人： Katsuhiko Igarashi ,  Makoto Orikasa ,  Takashi Kawashima ,  Hisayuki Abe

IPC分类号： G11B5/48

CPC分类号： G11B5/4833 ,  G11B5/4826

摘要： A magnetic head device with high joint strength in an arm and a suspension is provided. The magnetic head device comprises an arm, a suspension overlapping with a leading end part of the arm, a slider located at a leading end part of the suspension, and a joint part that is located between the leading end part of the arm and the suspension and that joins the arm and the suspension, while the joint part includes Sn.

公开(公告)号：US09514772B2

公开(公告)日：2016-12-06

申请号：US15071881

申请日：2016-03-16

申请人： TDK CORPORATION

发明人： Takashi Kawashima ,  Toru Mizuno ,  Katsuhiko Igarashi ,  Makoto Orikasa ,  Hidetoshi Suzuki

IPC分类号： G11B5/48 ,  G11B5/60

CPC分类号： G11B5/4833 ,  G11B5/4813 ,  G11B5/4826 ,  G11B5/6005

摘要： A magnetic head device which has strong joint strength in an arm and a suspension and high accuracy of a size and a shape is provided. The magnetic head device comprises an arm, a suspension overlapping with a leading end part of the arm, a slider located at a leading end part of the suspension, and a first joint part that is placed between the leading end part of the arm and the suspension and that joins the arm and the suspension, the first joint part including Sn or a resin adhesive.

摘要翻译： 提供了一种在臂上具有强的接合强度和悬挂性并且具有高精度的尺寸和形状的磁头装置。 磁头装置包括臂，与臂的前端部重叠的悬架，位于悬架的前端部的滑块，以及设置在臂的前端部和第二接头部之间的第一接合部， 悬挂，并且连接臂和悬架，第一接头部分包括Sn或树脂粘合剂。

公开(公告)号：US08787028B2

公开(公告)日：2014-07-22

申请号：US13677432

申请日：2012-11-15

申请人： TDK Corporation

发明人： Yuhei Horikawa ,  Shin Fujita ,  Kenichi Yoshida ,  Hisayuki Abe ,  Makoto Orikasa ,  Hideyuki Seike

IPC分类号： H05K7/00 ,  H05K1/02 ,  H01R43/02

CPC分类号： H05K1/11 ,  H01R4/02 ,  H01R43/00 ,  H05K1/111 ,  H05K1/141 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T29/49204

摘要： The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.

摘要翻译： 电子设备包括端子结构和包括端子结构的印刷电路板。 端子结构包括放置在布线导体上的焊点导体区域，与导体区域接触的中间层以及与中间层接触的焊料区域。 中间层包括包含锡和铜和镍中的至少一种作为主要成分的金属间化合物。 当导体区域的压痕弹性模量为E1，中间层的压痕弹性模量为E2时，E1与E2的比例等于或大于0.8且等于或小于1.5。

公开(公告)号：US11516951B2

公开(公告)日：2022-11-29

申请号：US16876583

申请日：2020-05-18

申请人： TDK CORPORATION

发明人： Takashi Yamada ,  Atsushi Sato ,  Makoto Orikasa ,  Hideharu Moro

IPC分类号： H01L23/552 ,  H05K9/00

摘要： A noise suppression sheet comprises at least one composite layer, the composite layer including: an insulating resin layer; a non-magnetic metal layer formed on the insulating resin layer; and a metal magnetic layer formed on the non-magnetic metal layer, and the composite layer has a through hole. When the noise suppression sheet comprises a plurality of composite layers, the through holes are misaligned in adjacent composite layers in the laminating direction.

公开(公告)号：US11088308B2

公开(公告)日：2021-08-10

申请号：US16794445

申请日：2020-02-19

申请人： TDK CORPORATION

发明人： Takasi Satou ,  Susumu Taniguchi ,  Hideyuki Kobayashi ,  Makoto Orikasa

IPC分类号： H01L33/62 ,  H01L23/00

摘要： A bonding structure is a bonding structure which bonds a light emitting element and a substrate and includes a first electrode formed on the light emitting element, a second electrode formed on the substrate, and a bonding layer which bonds the first electrode and the second electrode, and the bonding layer contains a first bonding metal component and a second bonding metal component different from the first bonding metal component.

公开(公告)号：US11031330B2

公开(公告)日：2021-06-08

申请号：US16811018

申请日：2020-03-06

申请人： TDK CORPORATION

发明人： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC分类号： H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

摘要： An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US10354796B2

公开(公告)日：2019-07-16

申请号：US15840243

申请日：2017-12-13

申请人： TDK Corporation

发明人： Yuhei Horikawa ,  Makoto Orikasa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe ,  Hirohumi Asou ,  Kosuke Kunitsuka

IPC分类号： H01F41/04 ,  H01F41/10 ,  C25D13/22 ,  C23C18/16 ,  C25D13/12 ,  G06K19/077 ,  H01Q1/38 ,  H01Q1/36 ,  H01Q9/27 ,  H05K3/24 ,  H05K3/18 ,  C25D5/48 ,  H01Q1/48 ,  H01Q7/00

摘要： Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.

公开(公告)号：US09257402B2

公开(公告)日：2016-02-09

申请号：US13960330

申请日：2013-08-06

申请人： TDK CORPORATION

发明人： Kenichi Yoshida ,  Makoto Orikasa ,  Hideyuki Seike ,  Yuhei Horikawa ,  Hisayuki Abe

IPC分类号： H01L23/48 ,  H01L23/00

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2224/05572 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, formed in a region in the opening on the electrode so that an upper surface of the metal layer is at a position lower than an upper surface of the insulating covering layer in a peripheral edge portion of the opening; and a dome-shaped bump containing Sn and Ti, formed in a region in the opening on the under bump metal layer, wherein an end portion of a boundary between the under bump metal layer and the bump is in contact with an inner wall of the opening portion in the insulating covering layer.

摘要翻译： 优选的端子结构包括基材; 形成在基材上的电极; 绝缘覆盖层，形成在所述基底材料上和所述电极上，并且具有暴露所述电极的至少一部分的开口; 在所述电极的开口部的区域形成含有Ni的下凸块金属层，使得所述金属层的上表面位于比所述开口的周缘部的绝缘覆盖层的上表面低的位置; 以及形成在下凸块金属层的开口部的区域中的包含Sn和Ti的圆顶状的凸部，其中，下凸块状金属层与凸块之间的边界的端部与内凸块 绝缘覆盖层的开口部。

公开(公告)号：US09177687B2

公开(公告)日：2015-11-03

申请号：US13677509

申请日：2012-11-15

申请人： TDK CORPORATION

发明人： Kenichi Yoshida ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hideyuki Seike

IPC分类号： B32B15/01 ,  H01B1/02 ,  C22C5/04 ,  C23C18/16 ,  C23C18/00 ,  C25D3/00 ,  C25D5/00 ,  C23C18/34 ,  C23C18/44 ,  C23C18/54

CPC分类号： H01B1/026 ,  C22C5/04 ,  C23C18/1651 ,  C23C18/34 ,  C23C18/44 ,  C23C18/54 ,  H01B1/02 ,  Y10T428/12701 ,  Y10T428/12722 ,  Y10T428/12778 ,  Y10T428/12861 ,  Y10T428/12889 ,  Y10T428/12903

摘要： A coating for a conductor, the coating having a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more, which means 65% or more of the crystal planes of the palladium layer are aligned to this crystal plane. Preferably the crystal plane whose orientation rate is 65% or more in the coating is the (111) plane or (200) plane.

摘要翻译： 一种用于导体的涂层，该涂层具有钯层的层状结构。 钯层具有取向率为65％以上的晶面，这意味着钯层的65％以上的晶面与该晶面对准。 优选地，涂层中取向率为65％以上的晶面是（111）面或（200）面。