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公开(公告)号：US11088308B2
公开(公告)日：2021-08-10
申请号：US16794445
申请日：2020-02-19
Applicant: TDK CORPORATION
Inventor： Takasi Satou , Susumu Taniguchi , Hideyuki Kobayashi , Makoto Orikasa
Abstract: A bonding structure is a bonding structure which bonds a light emitting element and a substrate and includes a first electrode formed on the light emitting element, a second electrode formed on the substrate, and a bonding layer which bonds the first electrode and the second electrode, and the bonding layer contains a first bonding metal component and a second bonding metal component different from the first bonding metal component.
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