Invention Grant
- Patent Title: Tape, encapsulating process and optical device
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Application No.: US16529569Application Date: 2019-08-01
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Publication No.: US11094858B2Publication Date: 2021-08-17
- Inventor: Jenchun Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L23/48 ; H01L21/00 ; H01L33/56 ; H01L33/54 ; H01L51/52 ; H01L23/31 ; H01L23/538 ; H01L21/56 ; H01L23/522 ; H01L23/00 ; G02B3/00 ; H01S5/183
Abstract:
A tape includes at least one tape unit. The tape unit includes a base structure having a first portion and a second portion. The first portion has a first surface and a second surface opposite to the first surface. The second portion protrudes from the second surface of the first portion, and has a third surface opposite to the first surface of the first portion and a lateral surface extending between the second surface and the third surface. An area of the first portion from a top view is greater than an area of the second portion from a top view.
Public/Granted literature
- US20210036194A1 TAPE, ENCAPSULATING PROCESS AND OPTICAL DEVICE Public/Granted day:2021-02-04
Information query
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