Invention Grant
- Patent Title: Fluid ejection die molded into molded body
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Application No.: US16485214Application Date: 2017-04-24
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Publication No.: US11097537B2Publication Date: 2021-08-24
- Inventor: Chien-Hua Chen , Michael W Cumbie , Anthony M Fuller
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dicke Billig & Czaja PLLC
- International Application: PCT/US2017/029213 WO 20170424
- International Announcement: WO2018/199909 WO 20181101
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
A fluid ejection device includes a molded body having a first molded surface and a second molded surface opposite the first molded surface, and a fluid ejection die molded into the molded body, with the fluid ejection die having a first surface substantially coplanar with the first molded surface of the molded body and a second surface substantially coplanar with the second molded surface of the molded body, with the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein and the second surface of the fluid ejection die having at least one fluid feed slot formed therein.
Public/Granted literature
- US20200247123A1 FLUID EJECTION DIE MOLDED INTO MOLDED BODY Public/Granted day:2020-08-06
Information query
IPC分类: