Invention Grant
- Patent Title: Bent substrate provided with print layer, and method for manufacturing same
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Application No.: US16152602Application Date: 2018-10-05
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Publication No.: US11097978B2Publication Date: 2021-08-24
- Inventor: Junji Hori , Satoshi Mototani , Jun Ito
- Applicant: AGC INC.
- Applicant Address: JP Chiyoda-ku
- Assignee: AGC INC.
- Current Assignee: AGC INC.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2016-078186 20160408
- Main IPC: B32B3/02
- IPC: B32B3/02 ; C03C17/00 ; B05D1/02 ; C03C17/22 ; C03C17/28 ; B05D1/32 ; B41M1/12 ; B41M1/40 ; B41M5/00 ; B41M7/00 ; B05D3/02 ; B32B3/28 ; B05D3/06

Abstract:
A method for manufacturing a bent substrate, having a masking step of forming a masking member (M) on a bent substrate (10) and forming a predetermined pattern, and a printing step of forming a print layer (P) on a surface to be printed of the bent substrate (10) including the masking member (M). It is thereby possible to perform printing on a bent substrate having a curved surface part in a productive manner and at a high printing accuracy.
Public/Granted literature
- US20190031559A1 BENT SUBSTRATE PROVIDED WITH PRINT LAYER, AND METHOD FOR MANUFACTURING SAME Public/Granted day:2019-01-31
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