Invention Grant
- Patent Title: Heat exchanger, heat exchange system, and heat exchange method
-
Application No.: US16498073Application Date: 2017-03-30
-
Publication No.: US11105566B2Publication Date: 2021-08-31
- Inventor: Koichi Todoroki , Arihiro Matsunaga , Minoru Yoshikawa
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- International Application: PCT/JP2017/013175 WO 20170330
- International Announcement: WO2018/179198 WO 20181004
- Main IPC: F28D9/02
- IPC: F28D9/02 ; F28F9/02 ; F28D7/00

Abstract:
The present invention provides a heat exchanger including a lower header into which a liquid-phase refrigerant flows, a plurality of heat exchange pipes which branch off from the lower header and extend upwards, and an upper header which is configured to collect refrigerant received by the heat exchange pipes, in which a refrigerant inlet of the lower header is provided with a flow passage resistance adjusting hole having a cross-section smaller than a flow passage cross-section of a pipe passage for supplying the refrigerant.
Information query