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1.发明授权公开(公告)号：US11903174B2
公开(公告)日：2024-02-13
申请号：US17440328
申请日：2019-03-18
Applicant: NEC Corporation
Inventor： Nirmal Singh Rajput , Yoshinori Miyamoto , Hisato Sakuma , Minoru Yoshikawa
CPC classification number: H05K7/20836 , F24F11/63 , G05B15/02 , H05K7/20745
Abstract: A system (20) for controlling an air conditioner (12) includes a plurality of pressure sensors (19) and a controller (13). Each of the pressure sensors (19) is positioned at an air inlet (15) of each of the racks (11). The controller (13) is configured to receive pressure values from the pressure sensors (19) and control an airflow rate of the cooling air supplied from the air conditioner (12) based on the pressure values. The controller (13) is configured to set a target pressure value for each pressure sensor (19) (S300), acquire a current pressure value for each pressure sensor (S401), calculate a pressure drop value for each pressure sensor (19) between the current pressure value and the target pressure value (S402), and adjust the airflow rate based on a maximum value among the plurality of the pressure drop values (S403 to S410).
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公开(公告)号：US11825630B2
公开(公告)日：2023-11-21
申请号：US17624910
申请日：2019-07-09
Applicant: NEC Corporation
Inventor： Takafumi Natsumeda , Minoru Yoshikawa , Masaki Chiba
IPC: H05K7/20
CPC classification number: H05K7/20327 , H05K7/20309 , H05K7/20318 , H05K7/20827
Abstract: A cooling system includes: a local cooler that is positioned near a heat source and evaporates a liquid-phase refrigerant by receiving heat from the heat source; a turbo compressor that compresses a gas-phase refrigerant that absorbed the heat in the local cooler; an outdoor unit that condenses the gas-phase refrigerant supplied from the turbo compressor by heat dissipation; and an expansion valve that depressurizes the refrigerant supplied from the outdoor unit and sends the refrigerant to the local cooler. The refrigerant is a low-pressure refrigerant having a condensing pressure lower than a predetermined value.
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公开(公告)号：US11363744B2
公开(公告)日：2022-06-14
申请号：US16643896
申请日：2017-09-06
Applicant: NEC Corporation
Inventor： Minoru Yoshikawa , Hisato Sakuma , Yoshinori Miyamoto , Masaki Chiba
IPC: H05K7/20
Abstract: When an enclosed space is formed, by at least one of surfaces forming an exterior shape of a shielding member and an intake or exhaust surface among surfaces forming an exterior shape of heat-generating housings, in such a way that a taken-in airflow and an exhausted airflow of the heat-generating housings installed in at least two rows can be separated or substantially separated, a cooling system includes: a duct formed to be able to separate or substantially separate a first airflow and a second airflow being intake/exhaust of a specific heat-generating housing among the heat-generating housings, and heat-generating housings other than the specific heat-generating housing, respectively; and a cooling enhancement unit enhancing cooling for the specific heat-generating housing by acting on the first airflow, thereby avoiding occurrence of a hot spot due to a high-heat-generating housing, in a system building an air-conditioning environment such as aisle capping.
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公开(公告)号：US11343946B2
公开(公告)日：2022-05-24
申请号：US16479630
申请日：2017-03-30
Applicant: NEC Corporation
Inventor： Arihiro Matsunaga , Koichi Todoroki , Hisato Sakuma , Minoru Yoshikawa
Abstract: A cooling system including a vaporizer configured to absorb heat due to a liquid-phase refrigerant being vaporized, a condenser configured to discharge heat due to a refrigerant in a gaseous phase state being liquefied, a resistance body provided in a middle of a pipe passage ranging from the vaporizer to the condenser and applying a resistance to the refrigerant, state detection sensors provided in the pipe passage on an upstream and downstream sides of the resistance body and detecting a state of the refrigerant flowing through each side inside the pipe passage, and a flow rate controller configured to detect droplets in the refrigerant flowing through the pipe passage on the basis of a difference between detection values of the state detection sensors which are detected on the upstream and downstream sides of the resistance body, and controls a flow rate of the refrigerant on the basis of detection results.
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公开(公告)号：US10813243B2
公开(公告)日：2020-10-20
申请号：US15506564
申请日：2015-08-20
Applicant: NEC Corporation
Inventor： Akira Shoujiguchi , Minoru Yoshikawa , Masaki Chiba , Arihiro Matsunaga , Masanori Sato
IPC: H05K7/20
Abstract: It is impossible to avoid the increase in device cost and maintenance cost in order to cool a plurality of heat sources efficiently using a natural-circulation type phase-change cooling device; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units configured to hold respectively refrigerant receiving heat from a plurality of heat sources; a condensing unit configured to generate refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant vapor; and a refrigerant liquid transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant liquid, wherein the refrigerant liquid transport structure includes a main-liquid-pipe connected to the condensing unit, a refrigerant liquid reservoir connected to the main-liquid-pipe and configured to store the refrigerant liquid, and a plurality of sub-liquid-pipes respectively connecting the refrigerant liquid reservoir to the plurality of heat receiving units.
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Patent Agency Ranking
公开(公告)号：US10215456B2
公开(公告)日：2019-02-26
申请号：US15036464
申请日：2014-12-05
Applicant: NEC Corporation , NEC Platforms, Ltd.
Inventor： Arihiro Matsunaga , Masaki Chiba , Minoru Yoshikawa , Tadao Hosaka , Shunsuke Fujii , Akira Shoujiguchi , Kenichi Inaba , Masanori Sato
Abstract: In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.
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公开(公告)号：US20150136362A1
公开(公告)日：2015-05-21
申请号：US14580443
申请日：2014-12-23
Applicant: NEC Corporation
Inventor： Minoru Yoshikawa
IPC: H05K7/20
CPC classification number: H05K7/20809 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20309 , H05K7/20318 , H05K7/20327 , H05K7/20336 , H05K7/208 , H01L2924/00
Abstract: A heat conveying structure for an electronic device, the heat conveying structure including an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant, a condensing section that has a chamber structure with second fins erected therein, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant, a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section, and a liquid pipe that connects the evaporating section and the condensing section.
Abstract translation: 一种用于电子设备的传热结构，所述传热结构包括具有其中竖立有第一散热片的腔室结构的蒸发部分，其与所述电子设备热连接，从而使所述第一翅片表面上的液体冷却剂蒸发，从而改变 将液体冷却剂输送到蒸气冷却剂，并将与第一散热片相邻的液体冷却剂与蒸气冷却剂一起作为气液两相流冷却剂发出，冷凝部分具有其中架设有第二散热片的室结构，并且改变 与第二散热片接触的气液两相流冷却剂至液体冷却剂，连接蒸发部和冷凝部的蒸汽管，使从蒸发部送出的气液二相流冷却器移动 连接到冷凝部，以及连接蒸发部和冷凝部的液体管。
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公开(公告)号：US20140326016A1
公开(公告)日：2014-11-06
申请号：US14370194
申请日：2012-12-21
Applicant: NEC Corporation
Inventor： Akira Shoujiguchi , Minoru Yoshikawa , Hitoshi Sakamoto , Masaki Chiba , Kenichi Inaba , Arihiro Matsunaga
CPC classification number: H05K7/208 , F25B39/00 , G06F1/20 , G06F2200/201 , H01L23/427 , H01L23/467 , H01L2924/0002 , H05K7/20309 , H05K7/20318 , H05K7/20809 , H01L2924/00
Abstract: A cooling device of the present invention is a cooling device arranged in a chassis equipped with an upper surface, and comprises: a refrigerant; a vaporizer that includes an evaporative vessel having a side face of a curved surface shape, and performs heat-absorption by making the refrigerant change its phase from a liquid phase state to a vapor phase state; a condenser that performs heat-radiation by making the refrigerant change its phase from a vapor phase state to a liquid phase state; a pipe that connects the vaporizer and the condenser; and a flow path suppression means for suppressing a cooling wind that flows between an area over the evaporative vessel and the upper surface.
Abstract translation: 本发明的冷却装置是布置在具有上表面的底盘中的冷却装置，包括：制冷剂; 蒸发器，其包括具有弯曲表面形状的侧面的蒸发容器，并且通过使制冷剂将其相位从液相状态转变为气相状态来进行吸热; 通过使制冷剂将其相位从气相状态转变为液相状态而进行热辐射的冷凝器; 连接蒸发器和冷凝器的管道; 以及流路抑制装置，用于抑制在蒸发容器上方的区域和上表面之间流动的冷却风。
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公开(公告)号：US11428442B2
公开(公告)日：2022-08-30
申请号：US16975918
申请日：2019-03-19
Applicant: NEC Corporation
Inventor： Hisato Sakuma , Koichi Todoroki , Masaki Chiba , Takafumi Natsumeda , Minoru Yoshikawa
Abstract: A cooling device includes a first evaporation unit, a second evaporation unit, a first condensation unit, a second condensation unit, common piping, a compressor, an expansion valve, a first valve, and a second valve. The common piping combines liquid-phase refrigerant flowing from the first condensation unit and liquid-phase refrigerant flowing from the second condensation unit. The first valve adjusts the liquid-phase refrigerant amount flowing into the first evaporation unit. The second valve adjusts the liquid-phase refrigerant amount flowing into the second evaporation unit. In addition, the pressure inside the common pipe is greater than the respective pressures inside the first evaporation unit and the second evaporation unit.
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公开(公告)号：US11226662B2
公开(公告)日：2022-01-18
申请号：US16498131
申请日：2017-03-29
Applicant: NEC CORPORATION
Inventor： Yoshinori Miyamoto , Manussanun Buranachokphaisan , Minoru Yoshikawa
IPC: F25J1/00 , G06F1/20 , G05B19/4155
Abstract: A management device includes: storage unit which stores a known intake air temperature of a heating element, and a heat transfer characteristic of a cooling device; heat extraction amount calculation unit which calculates a heat extraction amount of the cooling device, by use of the refrigerant information input by the input means, and a cooling capacity of the refrigerant; and air volume calculation unit which calculates an air volume of air supplied to the cooling device, by applying the heat extraction amount to air volume dependence of the heat extraction amount, being derived by use of air volume dependence of a difference temperature between a temperature of the refrigerant and a temperature of exhaust air from the heating element, and the heat transfer characteristic, the air volume dependence of the difference temperature being derived by use of the intake air temperature, the power consumption, and the refrigerant information.
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