Invention Grant
- Patent Title: Electronic panel assembly including circuit board assembly and method for manufacturing the same
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Application No.: US16829472Application Date: 2020-03-25
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Publication No.: US11109488B2Publication Date: 2021-08-31
- Inventor: DooSub Choi , Joong-Soo Moon , Sangmin Kang
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: Cantor Colburn LLP
- Priority: KR10-2019-0034026 20190326
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; G09F9/30 ; G02F1/1345 ; H01L27/32 ; H05K1/14

Abstract:
A circuit board assembly includes a flexible circuit board including a first surface, a second surface opposite to the first surface, sensing pads on the first surface, and a connector on the second surface, a first liner which includes a first rear surface covering a portion of the first surface and a first top surface that is opposite to the first rear surface and in which a first opening passing through the first rear surface from the first top surface is defined, a second liner which includes a second rear surface covering a portion of the second surface and a second top surface that is opposite to the second rear surface and in which a second opening passing through the second rear surface from the second top surface is defined. Each of the first and second openings is spaced apart from the flexible circuit board in a plan view.
Public/Granted literature
- US20200315018A1 ELECTRONIC PANEL ASSEMBLY INCLUDING CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-10-01
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