公开(公告)号：US11109488B2

公开(公告)日：2021-08-31

申请号：US16829472

申请日：2020-03-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： DooSub Choi ,  Joong-Soo Moon ,  Sangmin Kang

IPC: H05K1/18 ,  H05K1/02 ,  G09F9/30 ,  G02F1/1345 ,  H01L27/32 ,  H05K1/14

Abstract: A circuit board assembly includes a flexible circuit board including a first surface, a second surface opposite to the first surface, sensing pads on the first surface, and a connector on the second surface, a first liner which includes a first rear surface covering a portion of the first surface and a first top surface that is opposite to the first rear surface and in which a first opening passing through the first rear surface from the first top surface is defined, a second liner which includes a second rear surface covering a portion of the second surface and a second top surface that is opposite to the second rear surface and in which a second opening passing through the second rear surface from the second top surface is defined. Each of the first and second openings is spaced apart from the flexible circuit board in a plan view.