A multilayer substrate includes a lamination body including first and second resin substrates and a bonding layer that are hot-pressed. The first resin substrate includes a first surface provided with a first conductor pattern including a surface defined by a plated film, and a second surface provided with a second conductor pattern including a surface defined by a plated film. The second resin substrate includes a third surface provided with a third conductor pattern including a surface defined by a plated film, and a fourth surface provided with a fourth conductor pattern including a surface defined by a plated film. The first conductor pattern is located closer to a first outermost layer than the second conductor pattern. T1