Invention Grant
- Patent Title: Back-illuminated sensor and a method of manufacturing a sensor
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Application No.: US16562396Application Date: 2019-09-05
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Publication No.: US11114491B2Publication Date: 2021-09-07
- Inventor: Yung-Ho Alex Chuang , Jehn-Huar Chern , John Fielden , Jingjing Zhang , David L. Brown , Sisir Yalamanchili
- Applicant: KLA Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA Corporation
- Current Assignee: KLA Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Bever, Hoffman & Harms, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/148

Abstract:
An image sensor utilizes a pure boron layer and a second epitaxial layer having a p-type dopant concentration gradient to enhance sensing DUV, VUV or EUV radiation. Sensing (circuit) elements and associated metal interconnects are fabricated on an upper surface of a first epitaxial layer, then the second epitaxial layer is formed on a lower surface of the first epitaxial layer, and then a pure boron layer is formed on the second epitaxial layer. The p-type dopant concentration gradient is generated by systematically increasing a concentration of p-type dopant in the gas used during deposition/growth of the second epitaxial layer such that a lowest p-type dopant concentration of the second epitaxial layer occurs immediately adjacent to the interface with the first epitaxial layer, and such that a highest p-type dopant concentration of the second epitaxial layer occurs immediately adjacent to the interface with pure boron layer.
Information query
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