Invention Grant
- Patent Title: Printhead assembly
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Application No.: US16226904Application Date: 2018-12-20
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Publication No.: US11117376B2Publication Date: 2021-09-14
- Inventor: Si-lam J. Choy , Devin Mourey , Eric L. Nikkel
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: Dierker & Kavanaugh PC
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14 ; B41J2/155
Abstract:
A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.
Public/Granted literature
- US20190118535A1 PRINTHEAD ASSEMBLY Public/Granted day:2019-04-25
Information query
IPC分类:
