公开(公告)号：US11117376B2

公开(公告)日：2021-09-14

申请号：US16226904

申请日：2018-12-20

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-lam J. Choy ,  Devin Mourey ,  Eric L. Nikkel

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155

Abstract: A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.

公开(公告)号：US20190118535A1

公开(公告)日：2019-04-25

申请号：US16226904

申请日：2018-12-20

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Silam J. Choy ,  Devin Mourey ,  Eric L. Nikkel

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155

Abstract: A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.

公开(公告)号：US10195852B2

公开(公告)日：2019-02-05

申请号：US15507043

申请日：2014-08-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Silam J Choy ,  Devin Mourey ,  Eric L Nikkel

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155

Abstract: In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.

公开(公告)号：US20170266973A1

公开(公告)日：2017-09-21

申请号：US15507043

申请日：2014-08-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Silam J Choy ,  Devin Mourey ,  Eric L Nikkel

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1637 ,  B41J2/14024 ,  B41J2/14072 ,  B41J2/1408 ,  B41J2/155 ,  B41J2/1603

Abstract: In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.