Invention Grant
- Patent Title: Solder alloy
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Application No.: US16605744Application Date: 2018-12-26
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Publication No.: US11123824B2Publication Date: 2021-09-21
- Inventor: Takahiro Yokoyama , Shunsaku Yoshikawa
- Applicant: SENJU METAL INDUSTRY CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP
- Priority: JPJP2017-255303 20171231
- International Application: PCT/JP2018/047747 WO 20181226
- International Announcement: WO2019/131718 WO 20190704
- Main IPC: B23K35/26
- IPC: B23K35/26 ; B23K103/08
Abstract:
A solder alloy has an alloy composition including, in mass %, 0.8% to 10% of Cu and Sn. The solder alloy includes an intermetallic compound. The intermetallic compound has a maximum grain size of 100 μm or less in a region at least 50 μm away from a surface of the solder alloy.
Public/Granted literature
- US20200376606A1 SOLDER ALLOY Public/Granted day:2020-12-03
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