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公开(公告)号:US20190358754A1
公开(公告)日:2019-11-28
申请号:US16306858
申请日:2018-04-04
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor: Hiroyuki YAMASAKI , Takashi HAGIWARA , Hiroyoshi KAWASAKI
IPC: B23K35/362 , C08K5/17 , C08K5/5317 , C08K5/5313
Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux.The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.
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公开(公告)号:US20240424615A1
公开(公告)日:2024-12-26
申请号:US18824432
申请日:2024-09-04
Applicant: Senju Metal Industry Co., Ltd.
Inventor: Takahiro Matsufuji , Shunsaku Yoshikawa , Hiroki Sudo
Abstract: Provided are a solder, a solder alloy, a solder ball, a solder paste, and a solder joint, which have a low melting point, high hardness in a high-temperature environment, heat cycle resistance, and electromigration resistance. The solder alloy has an alloy composition that includes, by mass %, Bi: 30 to 60%, Ag: 0.7 to 2.0%, Cu: more than 0% and 1.00% or less, Ni: 0.01 to 1.00%, Sb: 0.2 to 1.5%, with the balance being Sn.
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公开(公告)号:US12172243B2
公开(公告)日:2024-12-24
申请号:US17128239
申请日:2020-12-21
Applicant: Senju Metal Industry Co., Ltd.
Inventor: Yoko Kurasawa , Motohiro Onitsuka , Hisashi Tokutomi , Hiroyoshi Kawasaki
IPC: B23K35/362 , B23K35/02
Abstract: Provided is flux for resin flux cored solder using in a soldering method in which the resin flux cored solder is supplied into a through hole formed along a central axis of a soldering iron. The flux contains volatile rosin in an amount of 70 wt % or more and 98 wt % or less, non-volatile rosin in an amount of 0 wt % or more and 10% or less, and an activator in an amount of 2 wt % or more and 30 wt % or less, the activator including an organic acid in an amount of 0 wt % or more and 15 wt % or less, an organohalogen compound in an amount of 0.5 wt % and 15 wt % or less, an amine in an amount of 0 wt % or more and 5 wt % or less, and an amine hydrohalide salt in an amount of 0 wt % or more and 2.5 wt % or less.
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公开(公告)号:US20240326176A1
公开(公告)日:2024-10-03
申请号:US18712945
申请日:2022-12-01
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor: Yasuhisa SUKAWA , Hiroyuki YAMASAKI , Haruya SAKUMA , Masato SHIRATORI
CPC classification number: B23K35/3612 , H05K3/3489
Abstract: A flux containing a rosin (P), a compound (SA), an activator (provided that a compound corresponding to the compound (SA) is excluded), and a solvent (provided that a compound corresponding to the compound (SA) is excluded) is adopted. The compound (SA) is a compound represented by General Formula (sa). In Formula (sa), R11 represents a hydrocarbon group which may have a hydroxy group. R12 and R13 each independently represent a hydrocarbon group having 5 or less carbon atoms, which may have a substituent, a hydroxy group, or a hydrogen atom. m represents a positive integer.
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公开(公告)号:US20240261908A1
公开(公告)日:2024-08-08
申请号:US18560992
申请日:2022-05-27
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor: Tomohiro YAMAGAME , Shuta AKATSUKA , Sakie OKADA , Keisuke SHINOZAKI , Kenta INOUE
IPC: B23K35/36 , B23K35/02 , B23K35/362
CPC classification number: B23K35/3613 , B23K35/025 , B23K35/362
Abstract: The present invention uses a flux which contains a rosin, a rosin amine; one or more types of organic sulfonic acid selected from the group consisting of an alkane sulfonic acid, an alkanol sulfonic acid, and an aromatic sulfonic acid, a thixotropic agent, and a solvent, wherein: the rosin content is 5-50 mass %, inclusive, of the total amount (100 mass %) of the flux, the rosin content is 5-30 mass %, inclusive, of the total amount (100 mass %) of the flux, the organic sulfonic acid content is 0.2-10 mass %, inclusive, of the total amount (100 mass %) of the flux, and the proportion (mass ratio) of the rosin amine content to the organic sulfonic acid content is 3.33-10, inclusive.
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公开(公告)号:US12053843B2
公开(公告)日:2024-08-06
申请号:US17770142
申请日:2021-06-22
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor: Shunsaku Yoshikawa , Takashi Saito , Yuuki Iijima , Kanta Dei , Takahiro Matsufuji
IPC: B23K35/26 , B23K35/02 , C22C13/02 , B23K101/36
CPC classification number: B23K35/262 , B23K35/025 , C22C13/02 , B23K2101/36
Abstract: A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.
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公开(公告)号:US11931829B2
公开(公告)日:2024-03-19
申请号:US18022656
申请日:2021-08-20
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor: Tomohiro Yamagame , Yo Yamada
IPC: B23K35/362 , B23K35/02 , B23K35/36
CPC classification number: B23K35/362 , B23K35/025 , B23K35/3615 , B23K35/3618
Abstract: A flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant and 5 to 60 wt % of a nonionic surfactant. A solder paste contains a flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant, and 5 to 60 wt % of a nonionic surfactant and a metal powder.
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公开(公告)号:US20240042539A1
公开(公告)日:2024-02-08
申请号:US18380939
申请日:2023-10-17
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor: Tsutomu HIYAMA , Nobuhiro KOJIMA
CPC classification number: B23K3/08 , B23K3/04 , G01M3/30 , B23K2101/42
Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.
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公开(公告)号:US11826860B2
公开(公告)日:2023-11-28
申请号:US17799967
申请日:2021-02-17
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor: Hiroyoshi Kawasaki , Masato Shiratori , Kazuhiro Minegishi , Yuji Kawamata
IPC: B23K35/36 , B23K35/362 , B23K35/02
CPC classification number: B23K35/3618 , B23K35/0244 , B23K35/362
Abstract: A flux containing an organic acid, a water-soluble base agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid. The water-soluble base agent is one or more selected from the group consisting of a nonionic surfactant and a weak cationic surfactant. The content of the 1,2,3-propanetricarboxylic acid is 1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux, the total content of the water-soluble base agent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux, and the total content of the solvent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced and ball missing after reflow and flux residue washing is suppressed.
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公开(公告)号:US20230321768A1
公开(公告)日:2023-10-12
申请号:US18036963
申请日:2021-11-17
Applicant: SENJU METAL INDUSTRY CO., LTD.
Inventor: Kenta INOUE , Nanako MIYAGI , Tomoko NAGAI , Kazuyori TAKAGI , Akiko TAKAKI
IPC: B23K35/36 , B23K35/362
CPC classification number: B23K35/3613 , B23K35/362
Abstract: The present invention employs a flux which contains rosin, a solvent, a thixotropic agent and an activator. The thixotropic agent contains a polyamide (PA2). The PA2 is a condensation product of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid and an aliphatic amine having from 3 to 10 carbon atoms; and the aliphatic carboxylic acid includes an aliphatic dicarboxylic acid having from 11 to 20 carbon atoms. With respect to the endothermic amount calculated from the peak area of the differential scanning calorimetry curve of PA2 as obtained by differential scanning calorimetry measurement, the ratio of the endothermic amount within the range of from 50° C. to 190° C. to the total endothermic amount within the range of from 50° C. to 200° C. is 90% or more.
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