FLUX AND RESIN COMPOSITION FOR FLUX
    1.
    发明申请

    公开(公告)号:US20190358754A1

    公开(公告)日:2019-11-28

    申请号:US16306858

    申请日:2018-04-04

    Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux.The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

    Flux, resin flux cored solder using the flux, and soldering method

    公开(公告)号:US12172243B2

    公开(公告)日:2024-12-24

    申请号:US17128239

    申请日:2020-12-21

    Abstract: Provided is flux for resin flux cored solder using in a soldering method in which the resin flux cored solder is supplied into a through hole formed along a central axis of a soldering iron. The flux contains volatile rosin in an amount of 70 wt % or more and 98 wt % or less, non-volatile rosin in an amount of 0 wt % or more and 10% or less, and an activator in an amount of 2 wt % or more and 30 wt % or less, the activator including an organic acid in an amount of 0 wt % or more and 15 wt % or less, an organohalogen compound in an amount of 0.5 wt % and 15 wt % or less, an amine in an amount of 0 wt % or more and 5 wt % or less, and an amine hydrohalide salt in an amount of 0 wt % or more and 2.5 wt % or less.

    FLUX AND METHOD FOR PRODUCING ASSEMBLY
    4.
    发明公开

    公开(公告)号:US20240326176A1

    公开(公告)日:2024-10-03

    申请号:US18712945

    申请日:2022-12-01

    CPC classification number: B23K35/3612 H05K3/3489

    Abstract: A flux containing a rosin (P), a compound (SA), an activator (provided that a compound corresponding to the compound (SA) is excluded), and a solvent (provided that a compound corresponding to the compound (SA) is excluded) is adopted. The compound (SA) is a compound represented by General Formula (sa). In Formula (sa), R11 represents a hydrocarbon group which may have a hydroxy group. R12 and R13 each independently represent a hydrocarbon group having 5 or less carbon atoms, which may have a substituent, a hydroxy group, or a hydrogen atom. m represents a positive integer.

    FLUX AND SOLDER PASTE
    5.
    发明公开

    公开(公告)号:US20240261908A1

    公开(公告)日:2024-08-08

    申请号:US18560992

    申请日:2022-05-27

    CPC classification number: B23K35/3613 B23K35/025 B23K35/362

    Abstract: The present invention uses a flux which contains a rosin, a rosin amine; one or more types of organic sulfonic acid selected from the group consisting of an alkane sulfonic acid, an alkanol sulfonic acid, and an aromatic sulfonic acid, a thixotropic agent, and a solvent, wherein: the rosin content is 5-50 mass %, inclusive, of the total amount (100 mass %) of the flux, the rosin content is 5-30 mass %, inclusive, of the total amount (100 mass %) of the flux, the organic sulfonic acid content is 0.2-10 mass %, inclusive, of the total amount (100 mass %) of the flux, and the proportion (mass ratio) of the rosin amine content to the organic sulfonic acid content is 3.33-10, inclusive.

    Flux and solder paste
    9.
    发明授权

    公开(公告)号:US11826860B2

    公开(公告)日:2023-11-28

    申请号:US17799967

    申请日:2021-02-17

    CPC classification number: B23K35/3618 B23K35/0244 B23K35/362

    Abstract: A flux containing an organic acid, a water-soluble base agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid. The water-soluble base agent is one or more selected from the group consisting of a nonionic surfactant and a weak cationic surfactant. The content of the 1,2,3-propanetricarboxylic acid is 1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux, the total content of the water-soluble base agent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux, and the total content of the solvent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced and ball missing after reflow and flux residue washing is suppressed.

    FLUX AND SOLDER PASTE
    10.
    发明公开

    公开(公告)号:US20230321768A1

    公开(公告)日:2023-10-12

    申请号:US18036963

    申请日:2021-11-17

    CPC classification number: B23K35/3613 B23K35/362

    Abstract: The present invention employs a flux which contains rosin, a solvent, a thixotropic agent and an activator. The thixotropic agent contains a polyamide (PA2). The PA2 is a condensation product of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid and an aliphatic amine having from 3 to 10 carbon atoms; and the aliphatic carboxylic acid includes an aliphatic dicarboxylic acid having from 11 to 20 carbon atoms. With respect to the endothermic amount calculated from the peak area of the differential scanning calorimetry curve of PA2 as obtained by differential scanning calorimetry measurement, the ratio of the endothermic amount within the range of from 50° C. to 190° C. to the total endothermic amount within the range of from 50° C. to 200° C. is 90% or more.

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