Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US16741868Application Date: 2020-01-14
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Publication No.: US11133383B2Publication Date: 2021-09-28
- Inventor: Chang Woo Noh , Dong Il Bae , Geum Jong Bae
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2019-0076005 20190626
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L21/311 ; H01L21/84 ; H01L27/12 ; H01L29/08 ; H01L29/10 ; H01L29/165 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device including a buried insulating layer on a substrate; a lower semiconductor layer on the buried insulating layer, the lower semiconductor layer including a first material; a channel pattern on the lower semiconductor layer, the channel pattern being spaced apart from the lower semiconductor layer and including a second material different from the first material; and a gate electrode surrounding at least a portion of the channel pattern.
Information query
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