Invention Grant
- Patent Title: Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having semiconductor device
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Application No.: US16778103Application Date: 2020-01-31
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Publication No.: US11133402B2Publication Date: 2021-09-28
- Inventor: Tetsuhiro Tanaka , Ryo Tokumaru , Yasumasa Yamane , Akihisa Shimomura , Naoki Okuno
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Husch Blackwell LLP
- Priority: JP2014-169430 20140822
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/423 ; H01L29/786 ; H01L29/45 ; H01L29/49 ; H01L27/12

Abstract:
To provide a semiconductor device including an oxide semiconductor layer with high and stable electrical characteristics, the semiconductor device is manufactured by forming a first insulating layer, forming oxide over the first insulating layer and then removing the oxide n times (n is a natural number), forming an oxide semiconductor layer over the first insulating layer, forming a second insulating layer over the oxide semiconductor layer, and forming a conductive layer over the second insulating layer. Alternatively, the semiconductor device is manufactured by forming the oxide semiconductor layer over the first insulating layer, forming the second insulating layer over the oxide semiconductor layer, forming the oxide over the second insulating layer and then removing the oxide n times (n is a natural number), and forming the conductive layer over the second insulating layer.
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