Invention Grant
- Patent Title: Thick-film resistive element paste and use of thick-film resistive element paste in resistor
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Application No.: US16640441Application Date: 2018-08-22
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Publication No.: US11136257B2Publication Date: 2021-10-05
- Inventor: Natsuki Iguchi , Yuya Iguchi , Koichi Urano
- Applicant: KOA CORPORATION
- Applicant Address: JP Ina
- Assignee: KOA CORPORATION
- Current Assignee: KOA CORPORATION
- Current Assignee Address: JP Ina
- Agency: Crowell & Moring LLP
- Priority: JPJP2017-167102 20170831
- International Application: PCT/JP2018/030963 WO 20180822
- International Announcement: WO2019/044618 WO 20190307
- Main IPC: H01K1/00
- IPC: H01K1/00 ; H01B1/16 ; C03C3/00 ; H01B1/02 ; H01B1/22 ; H01L27/01 ; H05K1/09
Abstract:
This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.
Information query
