公开(公告)号：US11136257B2

公开(公告)日：2021-10-05

申请号：US16640441

申请日：2018-08-22

Applicant: KOA CORPORATION

Inventor： Natsuki Iguchi ,  Yuya Iguchi ,  Koichi Urano

IPC: H01K1/00 ,  H01B1/16 ,  C03C3/00 ,  H01B1/02 ,  H01B1/22 ,  H01L27/01 ,  H05K1/09

Abstract: This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.