Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16565546Application Date: 2019-09-10
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Publication No.: US11139322B2Publication Date: 2021-10-05
- Inventor: Yuta Endo
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Fish & Richardson P.C.
- Priority: JP2012-288973 20121228,JP2013-049261 20130312
- Main IPC: H01L27/12
- IPC: H01L27/12 ; G02F1/1368 ; G02F1/1362 ; H01L29/786

Abstract:
A semiconductor device with high aperture ratio is provided. The semiconductor device includes a transistor and a capacitor having a pair of electrodes. An oxide semiconductor layer formed over the same insulating surface is used for a channel formation region of the transistor and one of the electrodes of the capacitor. The other electrode of the capacitor is a transparent conductive film. One electrode of the capacitor is electrically connected to a wiring formed over the insulating surface over which a source electrode or a drain electrode of the transistor is provided, and the other electrode of the capacitor is electrically connected to one of the source electrode and the drain electrode of the transistor.
Public/Granted literature
- US20200006402A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-01-02
Information query
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