Invention Grant
- Patent Title: Production method of mold having recessed pattern, and manufacturing method of pattern sheet
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Application No.: US16175850Application Date: 2018-10-31
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Publication No.: US11141887B2Publication Date: 2021-10-12
- Inventor: Shotaro Ogawa , Toshihiro Usa , Kenichiro Tamaki
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2016-094287 20160510
- Main IPC: B29C33/38
- IPC: B29C33/38 ; B29C59/02 ; B29C45/17 ; B29C45/37 ; A61M37/00 ; B29L31/00 ; C25D1/10 ; B29C33/40 ; B29C33/00 ; B29C33/20

Abstract:
Provided are a production method of a mold having a recessed pattern, and a manufacturing method of a pattern sheet having good accuracy and excellent productivity. The production method of a mold includes: a step of preparing an electroform having a protruding pattern and a mold having a first mold and a second mold forming a cavity; a step of fixing the electroform excluding an end portion of the electroform to the first mold; a clamping step of clamping the electroform excluding the end portion of the electroform and a region of the protruding pattern between the first mold and the second mold to form the cavity; and an injection step of filling the cavity with a resin.
Public/Granted literature
- US20190070754A1 PRODUCTION METHOD OF MOLD HAVING RECESSED PATTERN, AND MANUFACTURING METHOD OF PATTERN SHEET Public/Granted day:2019-03-07
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