- Patent Title: Microelectronic package electrostatic discharge (ESD) protection
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Application No.: US16659459Application Date: 2019-10-21
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Publication No.: US11147197B2Publication Date: 2021-10-12
- Inventor: Veronica Aleman Strong , Johanna M. Swan , Aleksandar Aleksov , Adel A. Elsherbini , Feras Eid
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01L23/60 ; H01L21/48 ; C08G61/12 ; C08G73/06 ; C08G85/00 ; H01L23/498

Abstract:
Embodiments may relate to a material to provide electrostatic discharge (ESD) protection in an electrical device. The material may include first and second electrically-conductive carbon allotropes. The material may further include an electrically-conductive polymer that is chemically bonded to the first and second electrically-conductive carbon allotropes such that an electrical signal may pass between the first and second electrically-conductive carbon allotropes. Other embodiments may be described or claimed.
Public/Granted literature
- US20210120708A1 MICROELECTRONIC PACKAGE ELECTROSTATIC DISCHARGE (ESD) PROTECTION Public/Granted day:2021-04-22
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