Invention Grant
- Patent Title: Technologies for densely packaging network components for large scale indirect topologies
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Application No.: US15636766Application Date: 2017-06-29
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Publication No.: US11153105B2Publication Date: 2021-10-19
- Inventor: Mario Flajslik , Eric R. Borch , Michael A. Parker , Richard J. Dischler
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: H04L12/12
- IPC: H04L12/12 ; H04L12/24 ; H04L12/44 ; H04W40/28 ; H04L12/721 ; H04L12/933

Abstract:
Technologies for densely packaging network components for large scale indirect topologies include group of switches. The group of switches includes a stack of node switches that includes a first set of ports and a stack of global switches that includes a second set of ports. The stack of node switches are oriented orthogonally to the stack of global switches. Additionally, the first set of ports are oriented towards the second set of ports and the node switches are connected to the global switches through the first and second sets of ports. Other embodiments are also described and claimed.
Public/Granted literature
- US20190007224A1 TECHNOLOGIES FOR DENSELY PACKAGING NETWORK COMPONENTS FOR LARGE SCALE INDIRECT TOPOLOGIES Public/Granted day:2019-01-03
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