Invention Grant
- Patent Title: Electronic module
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Application No.: US16592786Application Date: 2019-10-04
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Publication No.: US11153973B2Publication Date: 2021-10-19
- Inventor: Kaipeng Chiang , Da-Jung Chen , Bau-Ru Lu , Chun Hsien Lu
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD.
- Current Assignee: CYNTEC CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; H05K7/20 ; H05K3/34 ; H02M3/156
Abstract:
An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.
Public/Granted literature
- US20210105898A1 Electronic Module Public/Granted day:2021-04-08
Information query
