公开(公告)号：US11134570B2

公开(公告)日：2021-09-28

申请号：US16248814

申请日：2019-01-16

Applicant: CYNTEC CO., LTD.

Inventor： Chun Hsien Lu ,  Bau-Ru Lu ,  Kaipeng Chiang

IPC: H01F27/29 ,  H05K1/18 ,  H01F5/00 ,  H01F27/06

Abstract: An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.

公开(公告)号：US10373894B2

公开(公告)日：2019-08-06

申请号：US15334308

申请日：2016-10-26

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Jeng-Jen Li ,  Kun-Hong Shih ,  Kaipeng Chiang

IPC: H05K1/00 ,  H01L23/495 ,  H01L21/56 ,  H05K1/02 ,  H05K1/18 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

公开(公告)号：US10199361B2

公开(公告)日：2019-02-05

申请号：US16021026

申请日：2018-06-28

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen

IPC: H01L25/16 ,  H05K1/18 ,  H05K3/34

Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.

公开(公告)号：US20180308829A1

公开(公告)日：2018-10-25

申请号：US16021026

申请日：2018-06-28

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen

IPC: H01L25/16 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L25/16 ,  H05K1/181 ,  H05K1/188 ,  H05K3/284 ,  H05K3/3405 ,  H05K3/3421 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10515 ,  H05K2203/0415

Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.

公开(公告)号：US10063098B2

公开(公告)日：2018-08-28

申请号：US15399742

申请日：2017-01-06

Applicant: CYNTEC CO., LTD.

Inventor： Huei-Ren You ,  Bau-Ru Lu ,  Kaipeng Chiang

IPC: H05K1/18 ,  H02J50/10 ,  H01F27/24 ,  H01F27/29 ,  H05K1/02 ,  H05K1/11 ,  H01F17/04 ,  H05K3/36 ,  H05K1/14

CPC classification number: H02J50/10 ,  H01F17/04 ,  H01F27/24 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/048 ,  H05K1/0203 ,  H05K1/0262 ,  H05K1/117 ,  H05K1/141 ,  H05K1/184 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10545

Abstract: An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.

公开(公告)号：US09451701B2

公开(公告)日：2016-09-20

申请号：US14594083

申请日：2015-01-10

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

公开(公告)号：US20200286980A1

公开(公告)日：2020-09-10

申请号：US16690148

申请日：2019-11-21

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Jianhong Zeng ,  Chun Hsien Lu

IPC: H01L49/02 ,  H05K1/11 ,  H01L23/00 ,  H01L23/532 ,  H01L23/31 ,  H01L25/065

Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.

公开(公告)号：US20190131286A1

公开(公告)日：2019-05-02

申请号：US16231966

申请日：2018-12-25

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen

IPC: H01L25/16 ,  H05K1/18

Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar without using any substrate.

公开(公告)号：US09978611B2

公开(公告)日：2018-05-22

申请号：US15654703

申请日：2017-07-20

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Da-Jung Chen ,  Yi-Cheng Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495 ,  H01L21/768 ,  H01L25/00 ,  H01L25/16

CPC classification number: H01L21/4825 ,  H01L21/4821 ,  H01L21/76877 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24247 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49123 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer over the top surface or the bottom surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

公开(公告)号：US09911715B2

公开(公告)日：2018-03-06

申请号：US14492085

申请日：2014-09-22

Applicant: CYNTEC CO., LTD.

Inventor： Bau-Ru Lu ,  Ming-Chia Wu ,  Shao Wei Lu

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/552 ,  H05K5/02 ,  H05K5/06 ,  H05K1/11 ,  H05K3/42 ,  H05K7/02 ,  H05K7/20 ,  H01L23/13 ,  H01L23/36 ,  H01L23/373 ,  H01L23/40 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L25/0655 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/49811 ,  H01L23/5389 ,  H01L23/552 ,  H01L25/50 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/13055 ,  H05K1/115 ,  H05K3/42 ,  H05K5/0247 ,  H05K5/065 ,  H05K7/02 ,  H05K7/20509 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that the size of electronic package structure can be reduced. The three-dimensional package structure comprises a substrate, a first plurality of discrete conductive components and a connecting structure. The substrate has a top surface and a bottom surface. The first plurality of discrete conductive components are disposed over the bottom surface of the substrate. The connecting structure is disposed over the bottom surface of the substrate for encapsulating the first plurality of discrete electronic components. The connecting structure comprises at least one insulating layer and a plurality of conductive patterns separated by the at least one insulating layer. The plurality of conductive patterns are disposed over the first plurality of discrete electronic components for electrically connecting the first plurality of discrete electronic components.