发明授权
- 专利标题： Flexible organic-inorganic passivation layer and method of fabricating the same
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申请号： US16268805申请日： 2019-02-06
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公开(公告)号： US11158838B2公开(公告)日： 2021-10-26
- 发明人: Wooyoung Yang , Wenxu Xianyu , Yongsung Kim , Changseung Lee
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Sughrue Mion, PLLC
- 优先权： KR10-2018-0047319 20180424
- 主分类号： H01L51/52
- IPC分类号： H01L51/52 ; C23C16/455 ; C23C16/50 ; H01L51/10 ; C23C18/12
摘要：
Provided are a flexible organic-inorganic passivation film and a method of forming the same. The flexible organic-inorganic passivation film includes an organic-inorganic passivation film formed by alternately and repeatedly forming an organic film and an inorganic film on a substrate. The organic film is formed by stacking plasma-process generated material on a material layer thereunder. The plasma-process generated material is formed by plasma processing a hydrocarbon or a fluorocarbon.
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