Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US16643073Application Date: 2018-08-29
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Publication No.: US11164871B2Publication Date: 2021-11-02
- Inventor: Takanori Matsuzaki , Yoshinobu Asami , Daisuke Matsubayashi , Tatsuya Onuki
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP Atsugi
- Agency: Fish & Richardson P.C.
- Priority: JPJP2017-171238 20170906
- International Application: PCT/IB2018/056565 WO 20180829
- International Announcement: WO2019/048987 WO 20190314
- Main IPC: H01L27/105
- IPC: H01L27/105 ; H01L27/12 ; H01L29/786

Abstract:
A first transistor, a second transistor, a capacitor, and first to third conductors are included. The first transistor includes a first gate, a source, and a drain. The second transistor includes a second gate, a third gate over the second gate, first and second low-resistance regions, and an oxide sandwiched between the second gate and the third gate. The capacitor includes a first electrode, a second electrode, and an insulator sandwiched therebetween. The first low-resistance region overlaps with the first gate. The first conductor is electrically connected to the first gate and is connected to a bottom surface of the first low-resistance region. The capacitor overlaps with the first low-resistance region. The second conductor is electrically connected to the drain. The third conductor overlaps with the second conductor and is connected to the second conductor and a side surface of the second low-resistance region.
Information query
IPC分类: