Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US16529881Application Date: 2019-08-02
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Publication No.: US11170937B2Publication Date: 2021-11-09
- Inventor: Shogo Kanbe , Masahiro Andatsu , Kosuke Nakano , Hideki Otsuka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2017-023960 20170213
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G2/06 ; H01G4/12

Abstract:
A multilayer ceramic electronic component includes a laminate including external electrodes connected to a pair of metal terminals through a bonding material. Each of the pair of metal terminals includes a terminal body, an extension portion, and a mounting portion. The terminal body includes side-surface ribs, opposed to the side surfaces of the electronic component body. The bonding material is provided between the side-surface ribs and the external electrode opposed to the side-surface rib and is not provided between the terminal body and the end surface center portion of the external electrode.
Public/Granted literature
- US20190355522A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2019-11-21
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