公开(公告)号：US12266473B2

公开(公告)日：2025-04-01

申请号：US18195426

申请日：2023-05-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukihiro Fujita ,  Shogo Kanbe ,  Kosuke Nakano ,  Hideki Otsuka

IPC: H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H01G4/252

Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.

公开(公告)号：US10994366B2

公开(公告)日：2021-05-04

申请号：US16120522

申请日：2018-09-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi Ishino ,  Yoshihiro Kawaguchi ,  Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K20/16 ,  B22F1/00 ,  B22F7/06 ,  B23K20/02 ,  B23K1/00 ,  B23K3/06 ,  B23P6/00 ,  B23K20/227 ,  B23K35/30 ,  B23K35/00 ,  B23K35/02 ,  C22C1/04 ,  B23K20/233 ,  B23K101/10 ,  B23K101/06 ,  B23K101/18 ,  B23K103/04

Abstract: A repair method that includes covering a damaged part of a member to be repaired with a repair material, and heating the repair material to a predetermined temperature to form an alloy layer. At least the surface of the member to be repaired is a first metal such as Cu. The repair material includes a second metal such as Sn. By the heating, the surface of the member to be repaired is integrally joined with a layer of an intermetallic compound and an alloy having a melting point higher than a melting point of either of the first metal or the second metal.

公开(公告)号：US20160297029A1

公开(公告)日：2016-10-13

申请号：US15183105

申请日：2016-06-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi Ishino ,  Yoshihiro Kawaguchi ,  Kosuke Nakano ,  Hidekiyo Takaoka ,  Wataru Yanase

IPC: B23K20/02 ,  B23K35/30 ,  B23K20/00

CPC classification number: B23K20/026 ,  B23K1/00 ,  B23K20/002 ,  B23K35/302 ,  B23K35/3613 ,  C21D9/50

Abstract: A first structural material is bonded to a second structural material with a joining material provided with a mixed layer of a raw-material component for forming an intermetallic compound layer and a resin component that softens and flows during heat treatment interposed therebetween to form bonded structural materials. When the bonded structural materials are heat-treated, the first structural material is joined to the second structural material with an intermetallic compound layer, and the resin component exudes and covers the lateral circumferential (exposed) portion of the intermetallic compound layer with a resin film.

Abstract translation: 将第一结构材料与第二结构材料接合，所述接合材料设置有用于形成金属间化合物层的原料组分和在其间进行热处理软化和流动的树脂组分的混合层，以形成结合结构材料 。 当接合的结构材料进行热处理时，第一结构材料与金属间化合物层接合到第二结构材料，并且树脂组分用树脂膜渗出并覆盖金属间化合物层的外周（暴露）部分 。

公开(公告)号：US09412517B2

公开(公告)日：2016-08-09

申请号：US14450347

申请日：2014-08-04

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Hidekiyo Takaoka ,  Kosuke Nakano ,  Yutaka Ota ,  Kenichi Kawasaki

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H01G2/04 ,  H01G4/008 ,  H01G4/252

CPC classification number: H01G4/12 ,  H01G2/04 ,  H01G4/008 ,  H01G4/2325 ,  H01G4/252 ,  H01G4/30

Abstract: An electronic part that includes an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and a Sn-containing layer on the outer side of the alloy layer. The Sn-containing layer is the outermost layer of the external electrode. The Sn-containing layer is in contact with the alloy layer.

Abstract translation: 电子部件，其包括电子部件主体和电子部件主体的表面上的外部电极。 外部电极包括从Cu-Ni合金层和Cu-Mn合金层中选​​择的至少一种合金层和在合金层的外侧的含Sn层。 含Sn层是外部电极的最外层。 含Sn层与合金层接触。

公开(公告)号：US20140178703A1

公开(公告)日：2014-06-26

申请号：US14195018

申请日：2014-03-03

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K35/24 ,  H05K13/04 ,  B23K35/02

CPC classification number: B23K35/24 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/36 ,  C22C1/0425 ,  C22C1/0483 ,  C22C1/0491 ,  C22C9/01 ,  C22C13/00 ,  C22C13/02 ,  H05K13/0465 ,  Y10T428/31678

Abstract: An electroconductive material that includes a metal component containing a first metal and a second metal having a higher melting point than the first metal, and has a configuration in which the first metal is Sn or an alloy containing Sn, and the second metal is a Cu—Al alloy which forms, with the first metal, an intermetallic compound exhibiting a melting point of 310° C. or higher. The first metal can be Sn alone or an alloy containing Sn and at least one of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Pd, Si, Sr, Te, and P.

Abstract translation: 一种导电材料，其包括含有第一金属的金属成分和具有比第一金属高的熔点的第二金属，并且具有第一金属为Sn或含有Sn的合金的构造，第二金属为Cu -Al合金，其与第一金属形成熔点为310℃以上的金属间化合物。 第一金属可以是单独的Sn或含有Sn和Cu，Ni，Ag，Au，Sb，Zn，Bi，In，Ge，Al，Co，Mn，Fe，Cr，Mg，Pd，Si中的至少一种的合金 ，Sr，Te和P.

公开(公告)号：US11688555B2

公开(公告)日：2023-06-27

申请号：US17137498

申请日：2020-12-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukihiro Fujita ,  Shogo Kanbe ,  Kosuke Nakano ,  Hideki Otsuka

IPC: H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H01G4/252

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H01G4/252

Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.

公开(公告)号：US10010980B2

公开(公告)日：2018-07-03

申请号：US14697717

申请日：2015-04-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K35/02 ,  B23K1/00 ,  B23K35/26 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L23/00 ,  H05K3/34 ,  B23K35/36 ,  B23K35/362 ,  B23K101/40

CPC classification number: B23K35/025 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  B23K2101/40 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/11332 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83211 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  Y10T403/479 ,  Y10T428/31678 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, the second metal is one of (1) a Cu—Mn alloy in which a ratio of Mn to the second metal is 5 to 30% by weight and (2) a Cu—Ni alloy in which a ratio of Ni to the second metal is 5 to 20% by weight, and a ratio of the second metal to the metal component is 36.9% by volume or greater.

公开(公告)号：US09368279B2

公开(公告)日：2016-06-14

申请号：US14450347

申请日：2014-08-04

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Hidekiyo Takaoka ,  Kosuke Nakano ,  Yutaka Ota ,  Kenichi Kawasaki

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H01G2/04 ,  H01G4/008 ,  H01G4/252

Abstract: An electronic part that includes an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and a Sn-containing layer on the outer side of the alloy layer. The Sn-containing layer is the outermost layer of the external electrode. The Sn-containing layer is in contact with the alloy layer.

公开(公告)号：US09333593B2

公开(公告)日：2016-05-10

申请号：US14469842

申请日：2014-08-27

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K1/19 ,  B23K1/00 ,  B23K31/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/22 ,  C22C9/00 ,  C22C9/01 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34 ,  B23K35/02 ,  H01G4/228 ,  B23K1/20

CPC classification number: B23K31/02 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3026 ,  B23K2101/00 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/42 ,  C22C9/00 ,  C22C9/01 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01G4/228 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/1028 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T403/479

Abstract: A first joining object and a second joining object are joined to each other using an insert material. The first joining object and/or the second joining object has a first metal composed of Sn or an alloy containing Sn. The insert material contains, as a main component, a second metal which is an alloy containing at least one selected from among Ni, Mn, Al and Cr, and Cu, and is located between the first joining object and the second joining object. When subjected to heat treatment to produce an intermetallic compound of the first metal and the second metal, the first joining object and the second joining object are joined to each other.

Abstract translation: 使用插入材料将第一接合物体和第二接合物体彼此接合。 第一接合体和/或第二接合体具有由Sn或含有Sn的合金构成的第一金属。 插入材料含有作为主要成分的第二金属，其是含有选自Ni，Mn，Al和Cr中的至少一种的合金和Cu，并且位于第一接合物和第二接合物之间。 当进行热处理以产生第一金属和第二金属的金属间化合物时，第一接合物和第二接合物彼此接合。

公开(公告)号：US20160043480A1

公开(公告)日：2016-02-11

申请号：US14918648

申请日：2015-10-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: H01R4/02 ,  H01R4/58

CPC classification number: H01R4/02 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K2101/42 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01R4/58 ,  H05K3/3463 ,  H05K2201/0272 ,  Y10T403/479

Abstract: A joint structure that includes a first metal member, a second metal member, and a joint portion sandwiched between the first metal member and the second metal member. At least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a Cu3Sn layer nor a Cu6Sn5 layer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member.

Abstract translation: 一种接头结构，包括第一金属构件，第二金属构件和夹在第一金属构件和第二金属构件之间的接合部。 至少一种Cu-M-Sn金属间化合物分散在接头部分中，M是Ni和Mn中的至少一种，并且Cu 3 Sn层和Cu 6 Sn 5层不存在于接合部和 第一金属构件和第二金属构件。