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公开(公告)号：US11688555B2
公开(公告)日：2023-06-27
申请号：US17137498
申请日：2020-12-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yukihiro Fujita , Shogo Kanbe , Kosuke Nakano , Hideki Otsuka
Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.
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公开(公告)号：US11170937B2
公开(公告)日：2021-11-09
申请号：US16529881
申请日：2019-08-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shogo Kanbe , Masahiro Andatsu , Kosuke Nakano , Hideki Otsuka
Abstract: A multilayer ceramic electronic component includes a laminate including external electrodes connected to a pair of metal terminals through a bonding material. Each of the pair of metal terminals includes a terminal body, an extension portion, and a mounting portion. The terminal body includes side-surface ribs, opposed to the side surfaces of the electronic component body. The bonding material is provided between the side-surface ribs and the external electrode opposed to the side-surface rib and is not provided between the terminal body and the end surface center portion of the external electrode.
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公开(公告)号：US10971301B2
公开(公告)日：2021-04-06
申请号：US16427551
申请日：2019-05-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yukihiro Fujita , Shogo Kanbe , Kosuke Nakano , Hideki Otsuka
Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.
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