Invention Grant
- Patent Title: Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
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Application No.: US16741390Application Date: 2020-01-13
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Publication No.: US11176345B2Publication Date: 2021-11-16
- Inventor: Quy Chau , Mei-Lin Chan
- Applicant: InvenSense, Inc.
- Applicant Address: US CA San Jose
- Assignee: InvenSense, Inc.
- Current Assignee: InvenSense, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array of ultrasonic transducers, and an array controller configured to control activation of ultrasonic transducers during an imaging operation. During the imaging operation, the array controller is configured to control a transmission frequency of activated ultrasonic transducers during the imaging operation, wherein a plurality of transmission frequencies are used during the imaging operation to account for an impact of an interference pattern caused by the non-uniform thickness of the contact layer, and is configured to capture at least one fingerprint image using the plurality of transmission frequencies.
Public/Granted literature
- US20210019488A1 ULTRASONIC FINGERPRINT SENSOR WITH A CONTACT LAYER OF NON-UNIFORM THICKNESS Public/Granted day:2021-01-21
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