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    Method for MEMS structure with dual-level structural layer and acoustic port
    4.
    发明授权
    Method for MEMS structure with dual-level structural layer and acoustic port 有权
    具有双层结构层和声学端口的MEMS结构方法

    公开(公告)号：US09227842B2

    公开(公告)日：2016-01-05

    申请号：US14084569

    申请日：2013-11-19

    Applicant: Invensense, Inc.

    Inventor： Michael Julian Daneman ,  Mei-Lin Chan ,  Martin Lim ,  Fariboz Assaderaghi ,  Erhan Polatkan Ata

    IPC: H01L21/00 ,  B81C1/00

    CPC classification number: B81C1/00246 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/112 ,  B81C2203/0118 ,  B81C2203/0742 ,  B81C2203/0792 ,  H01L2224/83805

    Abstract: A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive structure layer. Patterning and etching of the silicon substrate is performed stopping at the second sacrificial layer. Additionally, the MEMS substrate is bonded to a CMOS wafer, the CMOS wafer having formed thereupon a metal layer. An electrical connection is formed between the MEMS substrate and the metal layer.

    Abstract translation: 一种用于制造MEMS器件的方法包括将第一牺牲层沉积并图案化到硅衬底上，第一牺牲层被部分去除留下第一剩余氧化物。 此外，该方法包括在硅衬底上沉积导电结构层，导电结构层与硅衬底的至少一部分进行物理接触。 此外，在导电结构层的顶部上形成第二牺牲层。 在第二牺牲层停止硅衬底的图案化和蚀刻。 此外，MEMS衬底被结合到CMOS晶片，其上形成有金属层的CMOS晶片。 在MEMS衬底和金属层之间形成电连接。

    Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
    5.
    发明授权
    Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness 有权

    公开(公告)号：US11216632B2

    公开(公告)日：2022-01-04

    申请号：US16741030

    申请日：2020-01-13

    Applicant: InvenSense, Inc.

    Inventor： Quy Chau ,  Mei-Lin Chan ,  Xiaoyue Jiang

    IPC: G06K9/00 ,  G06F3/043

    Abstract: An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array of ultrasonic transducers, and an array controller configured to control activation of ultrasonic transducers during an imaging operation for imaging a plurality of pixels at a plurality of positions within the two-dimensional array of ultrasonic transducers. For imaging a pixel of the plurality of pixels, the array controller is configured to activate a first subset of ultrasonic transducers of the two-dimensional array of ultrasonic transducers to generate an ultrasonic beam directed to a contact surface of the contact layer, and activate a second subset of ultrasonic transducers of the two-dimensional array of ultrasonic transducers to receive a reflected ultrasonic beam, wherein the second subset of ultrasonic transducers is at a location within the two-dimensional array of ultrasonic transducers to account for a local angle between the two-dimensional array of ultrasonic transducers and the contact surface where the ultrasonic beam interacts with the contact surface.

    Fake finger detection using ridge features
    6.
    发明授权
    Fake finger detection using ridge features 有权

    公开(公告)号：US11188735B2

    公开(公告)日：2021-11-30

    申请号：US16909917

    申请日：2020-06-23

    Applicant: InvenSense, Inc.

    Inventor： Sina Akhbari ,  Lingtao Wang ,  Mei-Lin Chan ,  Nikhil Apte

    IPC: G06K9/00

    Abstract: In a method for determining whether a finger is a real finger at an ultrasonic fingerprint sensor, a first image of a fingerprint pattern is captured at an ultrasonic fingerprint sensor, wherein the first image is based on ultrasonic signals corresponding to a first time of flight range. A second image of the fingerprint pattern is captured at the ultrasonic fingerprint sensor, wherein the second image is based on ultrasonic signals corresponding to a second time of flight range, the second time of flight range being delayed compared to the first time of flight range. A difference in a width of ridges of the fingerprint pattern in the first image compared to the width of ridges of the fingerprint pattern in the second image is quantified. Based on the quantification of the difference, a probability whether the finger is a real finger is determined.

    Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
    8.
    发明授权
    Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness 有权

    公开(公告)号：US11176345B2

    公开(公告)日：2021-11-16

    申请号：US16741390

    申请日：2020-01-13

    Applicant: InvenSense, Inc.

    Inventor： Quy Chau ,  Mei-Lin Chan

    IPC: G06K9/00

    Abstract: An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array of ultrasonic transducers, and an array controller configured to control activation of ultrasonic transducers during an imaging operation. During the imaging operation, the array controller is configured to control a transmission frequency of activated ultrasonic transducers during the imaging operation, wherein a plurality of transmission frequencies are used during the imaging operation to account for an impact of an interference pattern caused by the non-uniform thickness of the contact layer, and is configured to capture at least one fingerprint image using the plurality of transmission frequencies.

    Differential sensing acoustic sensor
    10.
    发明授权
    Differential sensing acoustic sensor 有权
    差分感应传感器

    公开(公告)号：US09344808B2

    公开(公告)日：2016-05-17

    申请号：US14218561

    申请日：2014-03-18

    Applicant: InvenSense, Inc.

    Inventor： Mei-Lin Chan ,  Michael Julian Daneman ,  Erhan Polatkan Ata ,  Xiang Li ,  Martin Lim

    IPC: H04R19/04 ,  H04R1/08 ,  H04R31/00 ,  B81C1/00 ,  H04R19/00

    CPC classification number: H04R19/04 ,  B81B2201/0257 ,  B81B2207/012 ,  B81C1/00238 ,  B81C2203/0792 ,  H04R1/08 ,  H04R19/005 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003

    Abstract: A MEMS device includes a first plate coupled to a second plate and a fixed third plate formed on a first substrate. The first and second plates are displaced in the presence of an acoustic pressure differential across the surfaces of the first plate. The MEMS device also includes a first electrode formed on the third plate and a second electrode formed on the second substrate. The first, second plate, and third plates are contained in an enclosure formed by a first and second substrates. The device includes an acoustic port to expose the first plate to the environment. The MEMS device also includes a first gap formed between the second and third plates and a second gap formed between the second plate and the second electrode. The displacement of the second plate causes the first gap to change inversely to the second gap.

    Abstract translation: MEMS器件包括耦合到第二板的第一板和形成在第一衬底上的固定的第三板。 在第一板的表面上存在声压差的情况下，第一和第二板被移位。 MEMS器件还包括形成在第三板上的第一电极和形成在第二衬底上的第二电极。 第一，第二板和第三板被包含在由第一和第二基板形成的外壳中。 该装置包括用于将第一板暴露于环境的声学端口。 MEMS器件还包括形成在第二和第三板之间的第一间隙和形成在第二板和第二电极之间的第二间隙。 第二板的位移导致第一间隙与第二间隙成反比变化。

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