Invention Grant
- Patent Title: Multi-fed patch antennas and devices including the same
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Application No.: US16181543Application Date: 2018-11-06
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Publication No.: US11177550B2Publication Date: 2021-11-16
- Inventor: Dooseok Choi , Thomas Byunghak Cho , Seung-chan Heo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2018-0003888 20180111,KR10-2018-0032345 20180320
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q1/48 ; H01Q21/06 ; H01Q9/04 ; H01Q25/00 ; H01Q3/34

Abstract:
A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.
Public/Granted literature
- US20190214703A1 MULTI-FED PATCH ANTENNAS AND DEVICES INCLUDING THE SAME Public/Granted day:2019-07-11
Information query