Multi-fed patch antennas and devices including the same

    公开(公告)号:US11177550B2

    公开(公告)日:2021-11-16

    申请号:US16181543

    申请日:2018-11-06

    Abstract: A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.

    Method of testing RF integrated circuit

    公开(公告)号:US10979150B2

    公开(公告)日:2021-04-13

    申请号:US16356088

    申请日:2019-03-18

    Abstract: A method of testing a radio frequency (RF) integrated circuit includes: forming, performed by the RF integrated circuit, a test loop that passes through a first transceiver circuit, a first front-end circuit, and a second transceiver circuit, based on a test control signal transmitted from a test device; adjusting, performed by the RF integrated circuit, a shift degree of at least one phase shifter in the first front-end circuit, based on the test control circuit; and receiving, performed by the RF integrated circuit, a test input signal via the first transceiver circuit from the test device, and outputting, to the test device, the test input signal that has passed through the test loop, wherein the test input signal is output as a test output signal via the second transceiver circuit.

    Receiver and wireless terminal for signal processing

    公开(公告)号:US10374850B2

    公开(公告)日:2019-08-06

    申请号:US15995801

    申请日:2018-06-01

    Abstract: A wireless terminal is provided that includes a first receiver that includes a first input unit configured to perform impedance matching on a first reception signal to output a first RF input signal. A first amplification unit is configured to amplify the first RF input signal to output one or more first RF output signals in an inter-band CA mode and an intra-band CA mode. A first output unit is configured to down-convert at least one of the one or more first RF output signals to a baseband. A second receiver includes a second output unit. In the intra-band CA mode, the one or more first RF output signals includes a first RF signal and a second RF signal, and the first amplification unit is further configured to provide the first output unit with the first RF signal and provide the second output unit with the second RF signal.

Patent Agency Ranking