- 专利标题: Manufacturing method of glass substrate having holes, manufacturing method of interposer substrate, and method for forming hole in glass substrate
-
申请号: US16375036申请日: 2019-04-04
-
公开(公告)号: US11179809B2公开(公告)日: 2021-11-23
- 发明人: Motoshi Ono
- 申请人: AGC INC.
- 申请人地址: JP Chiyoda-ku
- 专利权人: AGC INC.
- 当前专利权人: AGC INC.
- 当前专利权人地址: JP Chiyoda-ku
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JPJP2016-206083 20161020
- 主分类号: C03C15/00
- IPC分类号: C03C15/00 ; B23K26/362 ; C03B25/02 ; B23K26/08 ; B23K26/402 ; B23K26/60 ; H01L21/48 ; B23K26/382 ; B23K26/70 ; H01L23/15 ; B23K103/00
摘要:
A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.
公开/授权文献
信息查询