Invention Grant
- Patent Title: Manufacturing method of glass substrate having holes, manufacturing method of interposer substrate, and method for forming hole in glass substrate
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Application No.: US16375036Application Date: 2019-04-04
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Publication No.: US11179809B2Publication Date: 2021-11-23
- Inventor: Motoshi Ono
- Applicant: AGC INC.
- Applicant Address: JP Chiyoda-ku
- Assignee: AGC INC.
- Current Assignee: AGC INC.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2016-206083 20161020
- Main IPC: C03C15/00
- IPC: C03C15/00 ; B23K26/362 ; C03B25/02 ; B23K26/08 ; B23K26/402 ; B23K26/60 ; H01L21/48 ; B23K26/382 ; B23K26/70 ; H01L23/15 ; B23K103/00

Abstract:
A manufacturing method of a glass substrate having holes includes irradiating a plurality of hole formation target positions of a dummy glass substrate with a laser under a first condition, to form a plurality of holes in the dummy glass substrate; heating the dummy glass substrate under a second condition; measuring, for each of the hole formation target positions, a deviation between the hole formation target position and a position of the hole after the heating formed by irradiating the hole formation target position of the dummy glass substrate; irradiating irradiation target positions of a glass substrate, having substantially same shape, dimension and composition as the dummy glass substrate, with a laser under the first condition, to form a plurality of holes, the irradiation target positions of the glass substrate with the laser being determined taking into account the deviation; and heating the glass substrate under the second condition.
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