公开(公告)号：US20240217034A1

公开(公告)日：2024-07-04

申请号：US18395202

申请日：2023-12-22

申请人： ESS TECH, INC.

发明人： Nathan Imholt ,  Brady Thompson

IPC分类号： B23K26/362 ,  B23K26/352 ,  B23K26/60 ,  B23K26/70 ,  H01M8/026 ,  H01M8/18

CPC分类号： B23K26/362 ,  B23K26/3584 ,  B23K26/60 ,  B23K26/703 ,  H01M8/026 ,  H01M8/188

摘要： Systems and methods are provided for surface pretreatment of a bipolar plate for a battery system. In one example, a method for pretreating the bipolar plate includes extruding a material of the bipolar plate and irradiating a surface of the bipolar plate with a laser beam to etch a pattern into the surface. The method may further includes assembling the bipolar plate into a power module of the battery system.

公开(公告)号：US11945503B2

公开(公告)日：2024-04-02

申请号：US16766725

申请日：2018-11-26

申请人： ArcelorMittal

发明人： Cristian Alvarez ,  Thierry Lizon ,  Maria Poirier

IPC分类号： B23K26/60 ,  B21D22/02 ,  B23K26/00 ,  B23K26/24 ,  B23K33/00 ,  B23K35/24 ,  B23K35/38 ,  B62D21/15 ,  B62D27/02 ,  C21D6/00 ,  C21D9/50 ,  C22C19/05 ,  C22C30/02 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/38 ,  B23K101/00 ,  B23K101/18

CPC分类号： B62D21/15 ,  B21D22/022 ,  B23K26/0006 ,  B23K26/24 ,  B23K26/60 ,  B23K33/00 ,  B23K35/24 ,  B23K35/383 ,  B62D27/02 ,  C21D6/002 ,  C21D6/005 ,  C21D6/008 ,  C21D9/505 ,  C22C19/057 ,  C22C30/02 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/38 ,  B23K2101/006 ,  B23K2101/185

摘要： A method for producing a welded blank (1) includes providing two precoated sheets (2), butt welding the precoated sheets (2) using a filler wire. The precoating (5) entirely covers at least one face (4) of each sheet (2) at the time of butt welding. The filler wire (20) has a carbon content between 0.01 wt. % and 0.45 wt. %. The composition of the filler wire (20) and the proportion of filler wire (20) added to the weld pool is chosen such that the weld joint (22) has (a) a quenching factor FTWJ: FTWJ−0.9FTBM≥0, where FTBM is a quenching factor of the least hardenable substrate (3), and FTWJ and FTBM are determined: FT=128+1553×C+55×Mn+267×Si+49×Ni+5×Cr−79×Al−2×Ni2−1532×C2−5×Mn2−127×Si2−40×C×Ni−4×Ni×Mn, and (b) a carbon content CWJ 5000, where FA=10291+4384.1×Mo+3676.9Si−522.64×Al−2221.2×Cr−118.11×Ni−1565.1×C−246.67×Mn.

公开(公告)号：US20240042556A1

公开(公告)日：2024-02-08

申请号：US18381388

申请日：2023-10-18

申请人： ArcelorMittal

发明人： Francis SCHMIT ,  Rene VIERSTRAETE ,  Qingdong YIN ,  Wolfram EHLING

IPC分类号： B23K26/60 ,  B23K26/26 ,  B23K26/322 ,  B23K26/348 ,  B23K9/173 ,  B23K26/211 ,  B23K9/167 ,  B23K26/40 ,  B23K26/361 ,  B23K28/02 ,  B23K26/32

CPC分类号： B23K26/60 ,  B23K26/26 ,  B23K26/322 ,  B23K26/348 ,  B23K9/173 ,  B23K26/211 ,  B23K9/167 ,  B23K26/40 ,  B23K26/361 ,  B23K28/02 ,  B23K26/32 ,  B23K2101/006

摘要： A method for the preparation of steel sheets for fabricating a welded steel blank is provided. The method includes a step of removing at least part of the first and second metal alloy layers in first and second peripheral zones of pre-coated steel first and second sheets, respectively, by simultaneously ablating the first and second precoatings in the first and second peripheral zones of the pre-coated steel first and second sheets to define first and second ablation zones, the first and second peripheral zones being zones of the first and second principal faces closest to the median plane and located on either side of the median plane.

公开(公告)号：US11833612B2

公开(公告)日：2023-12-05

申请号：US17807683

申请日：2022-06-17

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Tetsuji Egawa ,  Eita Niisato ,  Jun Kitagawa ,  Masahiro Onoda

IPC分类号： B23K26/26 ,  B23K9/025 ,  B23K33/00 ,  B23P15/00 ,  B23K26/28 ,  B23K26/60 ,  B23K26/00 ,  B23K28/02 ,  B23K101/18 ,  B23K103/04

CPC分类号： B23K26/26 ,  B23K9/025 ,  B23K26/0093 ,  B23K26/28 ,  B23K26/60 ,  B23K28/02 ,  B23K33/00 ,  B23K33/002 ,  B23P15/00 ,  B23K2101/18 ,  B23K2103/04

摘要： A metal member includes a first plate, and a second plate abutting against and welded to the first plate in at least one butt portion. In the butt portion, a length from a first end to a second end of a welding boundary line between the first plate and the second plate is longer than a length of a straight line connecting the first end to the second end of the welding boundary line.

公开(公告)号：US11707802B2

公开(公告)日：2023-07-25

申请号：US16860702

申请日：2020-04-28

申请人： GM Global Technology Operations LLC

发明人： Huaxin Li ,  Liang Wang ,  Stephen R. McKenny ,  Daniel J. Wilson

IPC分类号： B23K26/035 ,  B23K26/24 ,  B23K26/06 ,  B23K26/062 ,  B23K26/08 ,  B23K26/60 ,  B23K26/12 ,  H05B6/10 ,  B23K103/04 ,  B23K101/00

CPC分类号： B23K26/035 ,  B23K26/062 ,  B23K26/0665 ,  B23K26/08 ,  B23K26/123 ,  B23K26/60 ,  B23K2101/008 ,  B23K2103/04 ,  H05B6/10

摘要： Angled, single laser weld and a method of forming an angled, single laser weld including arranging a first and second faying surfaces of a first and second component adjacently to form an interface between the components; irradiating at least one of the first and second components at the interface with a laser, wherein the first faying surface defines a plane formed at an angle alpha in the range of +/−5 degrees to 60 degrees from an axis A perpendicular to the first front surface and the second faying surface matches the first faying surface; and forming a junction at the interface with an hourglass shaped weld.

公开(公告)号：US20220410312A1

公开(公告)日：2022-12-29

申请号：US17471094

申请日：2021-09-09

申请人： Delta Electronics, Inc.

发明人： Chun-Lien HUANG ,  Wen-Yu CHUANG ,  Keng-Ning CHANG ,  Ting-Yu LU ,  Chun-Fei KUNG

IPC分类号： B23K26/06 ,  B23K26/60 ,  B23K26/03 ,  B23K1/005 ,  G05B19/418

摘要： A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.

公开(公告)号：US20220359353A1

公开(公告)日：2022-11-10

申请号：US17737831

申请日：2022-05-05

申请人： Analog Devices International Unlimited Company

发明人： Chee Leong Tham ,  Eng Tat Ng ,  Teik Tiong Toong

IPC分类号： H01L23/498 ,  B23K26/364 ,  B23K26/60 ,  H01L25/16 ,  H01L21/56 ,  H01L23/31

摘要： An integrated device package is disclosed. The integrated device package can include a substrate that has a first side and a second side, an electronic component that is mounted on the first side or the second side of the substrate, a molding material that is disposed at least on the first side of the substrate, and an conductive material that is disposed on the first side of the substrate and extending through the molding material. The molding material has an exterior surface facing away from the substrate. The exterior surface of the molding material includes laser grooves indicative of laser lapping.

公开(公告)号：US20220355415A1

公开(公告)日：2022-11-10

申请号：US17618842

申请日：2020-07-09

申请人： Robert Bosch GmbH

发明人： Lukas Alter

IPC分类号： B23K26/211 ,  B23K26/244 ,  B23K26/70 ,  B23K26/60 ,  B23K26/32 ,  B23K26/12

摘要： A production method for welding a copper conductor to an electrical contact element of a workpiece for electrical contacting. The contact element has a first copper alloy, and the method has the following method steps: mechanical contacting between the copper conductor and the contact element at a join of the contact element, the welding of the copper conductor to the contact element being carried out with the aid of a focused laser beam, the laser beam having a wavelength of less than or equal to 0.6 μm, and a welded seam is produced which has a welding depth that is greater than or equal to 100 μm.

公开(公告)号：US20220297193A1

公开(公告)日：2022-09-22

申请号：US17693878

申请日：2022-03-14

申请人： JEOL Ltd.

发明人： Masahiko Kawakami ,  Shio En ,  Ayumu Miyakita ,  Yuhei Kaneko

IPC分类号： B22F12/49 ,  B22F10/28 ,  B22F12/41 ,  B33Y10/00 ,  B33Y30/00 ,  B23K26/342 ,  B23K26/60

摘要： A three-dimensional PBF-AM apparatus includes: a build plate on which a powder material is spread in layers; and a beam irradiation device which irradiates the powder material spread on the build plate with a beam. The beam irradiation device divides a build region of the powder material spread on the build plate into a plurality of lines and performs beam scanning to melt the powder material in the build region line by line, and performs dummy scanning to scan the beam in a state that does not cause melting of the powder material between an end of beam scanning of an M-th (M is a natural number) line and a start of beam scanning of an (M+1)th line.

公开(公告)号：US11135677B2

公开(公告)日：2021-10-05

申请号：US15913180

申请日：2018-03-06

申请人： General Electric Company

发明人： Fabrizio Mangano ,  Piero-Daniele Grasso ,  Norbert Lucke ,  Michael Seemann

IPC分类号： B23K26/26 ,  B23K35/02 ,  B23P6/04 ,  B23K26/60 ,  B23P6/00 ,  F01D5/00 ,  C22F1/10 ,  B23K26/34 ,  B23K26/00 ,  B23K26/70 ,  B23K103/18 ,  B23K101/00 ,  B23K103/00 ,  B23K101/34

摘要： Methods of repair of a component or adding material to a component using laser welding are disclosed. One method may include repairing or adding material to the component by laser irradiating a wire material with a laser in an inert gas in a vicinity of the component. The laser irradiating the wire material includes modulated pulsing the laser through: a warm up phase during which an on-power of the laser is increased over time to a maximum target on-power, a melt and bond phase during which the wire material is melted and during which the on-power is less than the maximum target on-power, and a stress releasing phase during which the on-power of the laser is less than the on-power during the melt and bond phase. The laser irradiated wire material forms a weld material to repair a damaged area or add material to the component.