- 专利标题: Light irradiation type heat treatment apparatus
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申请号: US16055293申请日: 2018-08-06
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公开(公告)号: US11183403B2公开(公告)日: 2021-11-23
- 发明人: Masashi Furukawa , Yoshio Ito
- 申请人: SCREEN Holdings Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: SCREEN Holdings Co., Ltd.
- 当前专利权人: SCREEN Holdings Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Ostrolenk Faber LLP
- 优先权: JPJP2017-181049 20170921
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/687
摘要:
A semiconductor wafer held by a susceptor in a chamber is irradiated with halogen light radiated from a plurality of halogen lamps to be heated. A stainless steel block having an opening in a cylindrical shape is provided between the chamber and the halogen lamps. This reduces a distance from a light emitting portion in a light source region in which the plurality of halogen lamps is arranged, throughout the entire circumference of the opening in a cylindrical shape, so that the amount of reflected light from the inner wall surface of the opening toward the peripheral portion of the semiconductor wafer becomes uniform. This causes a uniform increase in illuminance of the peripheral portion of the semiconductor wafer, where temperature tends to decrease, at the time of light irradiation from the halogen lamps, so that in-plane temperature distribution of the semiconductor wafer can be made uniform.
公开/授权文献
- US20190088513A1 LIGHT IRRADIATION TYPE HEAT TREATMENT APPARATUS 公开/授权日:2019-03-21
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