Invention Grant
- Patent Title: Hyperelastic binder for printed, stretchable electronics
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Application No.: US16189701Application Date: 2018-11-13
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Publication No.: US11184976B2Publication Date: 2021-11-23
- Inventor: Joseph Wang , Rajan Kumar , Ying Shirley Meng , Jae Wook Shin , Lu Yin
- Applicant: The Regents of the University of California
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- Agency: Perkins Coie LLP
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; C08L53/02 ; A61B5/1477 ; H01M4/38 ; H01M4/48 ; H01M4/62 ; H01M4/66 ; H01M10/24 ; C08F297/04 ; H05K1/03 ; H05K1/11 ; H05K1/16 ; H05K3/32 ; C01B32/158 ; A61B5/1486 ; A61F13/49 ; H01M10/0565

Abstract:
Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.
Public/Granted literature
- US20190159337A1 HYPERELASTIC BINDER FOR PRINTED, STRETCHABLE ELECTRONICS Public/Granted day:2019-05-23
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