Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US16836342Application Date: 2020-03-31
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Publication No.: US11189424B2Publication Date: 2021-11-30
- Inventor: Jun Hyeon Kim , Hae Sol Kang , Bon Seok Koo , San Kyeong , Chang Hak Choi , Jung Min Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0109673 20190904
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/228 ; H01G4/12 ; H01G4/30

Abstract:
A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.
Public/Granted literature
- US20210065981A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2021-03-04
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