Invention Grant
- Patent Title: Apparatus and method of attaching pad on edge ring
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Application No.: US16444590Application Date: 2019-06-18
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Publication No.: US11189467B2Publication Date: 2021-11-30
- Inventor: Jin-Uk Park , Sun-Ho Kim , Sung-Jin Kim , Jong-Geug Kim , Kyu-Chul Shim , Ji-Hoon Yeo , Shin-Sang Lee , Gyu-Chan Jeoung , Sung-Wook Jung , Jae-Chul Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers BigeL P.A.
- Priority: KR10-2018-0143663 20181120
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/687

Abstract:
An apparatus for attaching a pad on or to an edge ring includes a chamber defining a space for attaching a pad on or to an edge ring, a pad support within the chamber and supporting the pad thereon, an edge ring support within the chamber and facing the pad support, the edge ring support securing the edge ring thereon, a driving system connected to at least one of the pad support and the edge ring support and configured to move the edge ring support relative to the pad support, and a vacuum exhaust system configured to create a vacuum atmosphere within the chamber.
Public/Granted literature
- US20200161099A1 APPARATUS AND METHOD OF ATTACHING PAD ON EDGE RING Public/Granted day:2020-05-21
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