Invention Grant
- Patent Title: Device assembly structure and method of manufacturing the same
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Application No.: US16653650Application Date: 2019-10-15
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Publication No.: US11189604B2Publication Date: 2021-11-30
- Inventor: Chao-Kai Hung , Chien-Wei Chang , Ya-Chen Shih , Hung-Jung Tu , Hung-Yi Lin , Cheng-Yuan Kung
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L23/00 ; H01L25/00

Abstract:
A device assembly structure includes a first device and at least one second device. The first device has a first active surface and a first backside surface opposite to the first active surface, and includes a plurality of first electrical contacts disposed adjacent to the first active surface. The second device has a second active surface and a second backside surface opposite to the second active surface, and includes a plurality of second electrical contacts disposed adjacent to the second active surface. The second active surface of the second device faces the first active surface of the first device, the second electrical contacts of the second device are electrically connected to the first electrical contacts of the first device, and a thickness of the second device is less than or equal to one fifth of a thickness of the first device.
Public/Granted literature
- US20210111165A1 DEVICE ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-04-15
Information query
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