公开(公告)号：US11424212B2

公开(公告)日：2022-08-23

申请号：US16514966

申请日：2019-07-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Wei Chang ,  Shang-Wei Yeh ,  Chung-Hsi Wu ,  Min Lung Huang

IPC: H01L23/00 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/11

Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.

公开(公告)号：US11189604B2

公开(公告)日：2021-11-30

申请号：US16653650

申请日：2019-10-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao-Kai Hung ,  Chien-Wei Chang ,  Ya-Chen Shih ,  Hung-Jung Tu ,  Hung-Yi Lin ,  Cheng-Yuan Kung

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/00

Abstract: A device assembly structure includes a first device and at least one second device. The first device has a first active surface and a first backside surface opposite to the first active surface, and includes a plurality of first electrical contacts disposed adjacent to the first active surface. The second device has a second active surface and a second backside surface opposite to the second active surface, and includes a plurality of second electrical contacts disposed adjacent to the second active surface. The second active surface of the second device faces the first active surface of the first device, the second electrical contacts of the second device are electrically connected to the first electrical contacts of the first device, and a thickness of the second device is less than or equal to one fifth of a thickness of the first device.

公开(公告)号：US12040312B2

公开(公告)日：2024-07-16

申请号：US17893037

申请日：2022-08-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Wei Chang ,  Shang-Wei Yeh ,  Chung-Hsi Wu ,  Min Lung Huang

IPC: H01L25/065 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L25/04 ,  H01L25/07 ,  H01L25/075 ,  H01L25/11 ,  H01L25/16

CPC classification number: H01L25/0652 ,  H01L21/566 ,  H01L21/76871 ,  H01L23/3107 ,  H01L23/3192 ,  H01L24/09 ,  H01L24/49 ,  H01L24/85 ,  H01L25/071 ,  H01L25/112 ,  H01L25/042 ,  H01L25/043 ,  H01L25/0756 ,  H01L25/162 ,  H01L2224/02371

Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.