- 专利标题： System for and method of manufacturing three-dimensional structure
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申请号： US16788413申请日： 2020-02-12
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公开(公告)号： US11192300B2公开(公告)日： 2021-12-07
- 发明人: Ji-Young Oh , Yong Suk Yang , Kyung Hyun Kim , Kyu Sung Lee
- 申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 申请人地址： KR Daejeon
- 专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人地址： KR Daejeon
- 代理机构： Rabin & Berdo, P.C.
- 优先权： KR10-2016-0170655 20161214,KR10-2017-0071907 20170608
- 主分类号： B29C64/209
- IPC分类号： B29C64/209 ; B29C64/171 ; B29C64/165 ; B29C64/241 ; B29C64/106 ; B33Y30/00 ; B33Y10/00 ; B29C64/159 ; B29C64/321 ; B29C64/236
摘要：
Disclosed are a system for and a method of manufacturing a three-dimensional (3D) structure. The method may include injecting a fluid with a first pressure toward a surface of a first output layer to form a softening layer in the first output layer, injecting the fluid with a second pressure toward the softening layer to form an uneven structure in the softening layer, the second pressure being higher than the first pressure, and forming a second output layer on the softening layer with the uneven structure.