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    Method of manufacturing a planarizing printed electronic device
    4.
    发明授权
    Method of manufacturing a planarizing printed electronic device 有权
    制造平面印刷电子装置的方法

    公开(公告)号：US09345123B2

    公开(公告)日：2016-05-17

    申请号：US13934635

    申请日：2013-07-03

    申请人： Electronics and Telecommunications Research Institute

    发明人： Yong Suk Yang ,  In-Kyu You ,  Minseok Kim ,  Soon-Won Jung ,  Bock Soon Na ,  Sang Chul Lim

    IPC分类号： H05K3/02 ,  H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H01L51/00 ,  H05K1/03 ,  H01L51/10 ,  H01L51/44 ,  H01L51/52

    CPC分类号： H05K1/02 ,  H01L51/0022 ,  H01L51/003 ,  H01L51/102 ,  H01L51/441 ,  H01L51/5203 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/207 ,  H05K2201/0376

    摘要： A method for manufacturing a planarized printed electronic device includes performing a surface treatment on a base substrate to provide a surface treated base substrate and facilitate release during a delamination process; printing a layer having an electrode pattern onto the surface-treated base substrate; forming an organic material layer comprised of an organic material on the base substrate on which the printed layer is printed such that the printed layer is embedded therein to provide an embedded layer; providing a target substrate onto which the embedded layer is to be transferred; laminating by sandwiching the embedded layer between the base substrate on which the embedded layer is formed and the target substrate; delaminating by detaching the embedded layer from the base substrate; and transferring the printed layer onto the target substrate to provide a planarized printed layer. Large areas with reduced defects due to surface roughness are possible.

    摘要翻译： 制造平面化印刷电子器件的方法包括在基底基板上进行表面处理以提供经表面处理的基底基板，并在分层过程中促进释放; 将具有电极图案的层印刷到经表面处理的基底上; 在所述基底基板上形成有机材料层，所述有机材料层在所述基底基板上印刷所述印刷层，使得所述印刷层嵌入其中以提供嵌入层; 提供要在其上传输嵌入层的目标衬底; 通过将嵌入层夹在其上形成有嵌入层的基底基板与靶基板之间进行层压; 通过从基底衬底分离嵌入层来分层; 并将印刷层转印到目标衬底上以提供平坦化的印刷层。 由于表面粗糙度而导致缺陷减少的大面积是可能的。

    ACTIVE CLICHE FOR LARGE-AREA PRINTING, MANUFACTURING METHOD OF THE SAME, AND PRINTING METHOD USING THE SAME
    5.
    发明申请
    ACTIVE CLICHE FOR LARGE-AREA PRINTING, MANUFACTURING METHOD OF THE SAME, AND PRINTING METHOD USING THE SAME 有权
    用于大面积打印的主动夹层及其制造方法及使用其的印刷方法

    公开(公告)号：US20140063124A1

    公开(公告)日：2014-03-06

    申请号：US13966336

    申请日：2013-08-14

    申请人： Electronics and Telecommunications Research Institute

    发明人： Yong Suk Yang ,  In-Kyu You ,  Soon-Won Jung ,  Bock Soon Na ,  Seok-Hwan Moon

    IPC分类号： B41J2/14 ,  B41J2/16

    CPC分类号： B41J2/1626 ,  B41J2/06 ,  B41J2/14 ,  B41J2/16 ,  B41J2/162 ,  B41J2/1621 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2202/04

    摘要： Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.

    摘要翻译： 提供了一种大面积纳米级活性印刷装置及其制造方法，以及使用其的印刷方法。 打印装置可以包括基板，沿着第一方向延伸的第一互连线，在基板上，设置在第一互连线上的具有部分地暴露第一互连线的孔的层间电介质层，邻近孔的第二互连线 所述层间电介质层与所述第一互连线交叉，以及设置在与所述第一和第二互连线交叉并与所述第一互连线连接的楔形电极。 楔形电极在孔的中心向上突出。