Invention Grant
- Patent Title: Build layer temperature control
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Application No.: US15770476Application Date: 2016-02-08
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Publication No.: US11192306B2Publication Date: 2021-12-07
- Inventor: Yan Zhao , Aja Hartman , Lihua Zhao
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Mannava & Kang
- International Application: PCT/US2016/017004 WO 20160208
- International Announcement: WO2017/138915 WO 20170817
- Main IPC: B29C64/393
- IPC: B29C64/393 ; B33Y50/02 ; B29C64/165 ; B33Y10/00 ; B33Y40/00

Abstract:
Examples include an apparatus for generating a three-dimensional object. The apparatus comprises at least one energy source, at least one build layer temperature sensor, and a controller. The controller is to control the at least one energy source to pre-fuse a portion of a build layer in a build area when a build layer temperature is less than a first temperature threshold. The controller is further to, after pre-fusing the portion of the build layer, control the at least one energy source to fuse the portion of the build layer in the build area when the build layer temperature is less than a second threshold.
Public/Granted literature
- US20190054699A1 BUILD LAYER TEMPERATURE CONTROL Public/Granted day:2019-02-21
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