Invention Grant
- Patent Title: Microelectromechanical systems gyroscope
-
Application No.: US17016870Application Date: 2020-09-10
-
Publication No.: US11193770B2Publication Date: 2021-12-07
- Inventor: Shih-Wei Lee , Chao-Shiun Wang
- Applicant: SENSORTEK TECHNOLOGY CORP.
- Applicant Address: TW Zhubei
- Assignee: SENSORTEK TECHNOLOGY CORP.
- Current Assignee: SENSORTEK TECHNOLOGY CORP.
- Current Assignee Address: TW Zhubei
- Agency: Rosenberg, Klein & Lee
- Main IPC: G01C19/5712
- IPC: G01C19/5712

Abstract:
The invention related to a microelectromechanical systems gyroscope, which comprises a plurality of sensing modules sensing angular velocities on tri-axes, a plurality of outer frames set at outside of the sensing modules, and a plurality of driving shafts set between the frames respectively. The driving shafts are connected with two adjacent frames by first and second flexible connecting elements, respectively, and the frames are connected with the sensing modules by a plurality of transporting units. Thus, tri-axes sensing is provided.
Public/Granted literature
- US20210088335A1 MICROELECTROMECHANICAL SYSTEMS GYROSCOPE Public/Granted day:2021-03-25
Information query